Addition-cure, room temperature vulcanizing silicone elastomer based syntactic foams with glass and ceramic microballoons

Alex, Ancy Smitha; Thomas, Deepthi; Manu, S. K.; Sreenivas, N.; Sekkar, V.; Gouri, C.

doi:10.1007/s00289-017-2052-9

Cited by 11 publications

(11 citation statements)

References 34 publications

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“…The experiments are presented in the Supporting Information. , Instead of forming six coordination bonds, steric hindrance and entanglement of the polymer chains reduced the efficiency of Fe 3+ coordination and resulted in tough elastomers when the value of n (N + CO)/ n (Fe 3+ ) < 6. The tensile strength of E-11-Fe-3-880 without fillers could reach 3.45 MPa, which is much higher than the tensile strength of previously reported silicon elastomers. − The tensile strengths of the other samples are shown in the Supporting Information.…”

Section: Resultsmentioning

confidence: 83%

“…Organosilicon materials have elicited considerable interest in chemistry and material sciences and are extensively applied in every field of human life due to their excellent properties. − However, the mechanical properties of silicon elastomers are much weaker than those of natural or conventional synthetic rubber, and this deficiency limits the further application of silicon elastomers. Most chemically cross-linked silicon elastomers without fillers are too soft or fragile.…”

Section: Introductionmentioning

confidence: 99%

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Self-Recoverable Dual-Network Silicon Elastomer Applied in Cell Adhesives

Wang³

et al. 2019

ACS Appl. Polym. Mater.

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Dual-network filler-free silicon elastomers with excellent mechanical properties and high tensile strength (>3 MPa) were fabricated through physical and chemical crosslinking via Fe 3+ ion coordination and aza-Michael addition, respectively. Dynamic mechanical analysis and loading− unloading tests were used to analyze the sacrificial bonds and dual networks in the elastomers. Continuous-wave electron paramagnetic resonance results revealed the incomplete coordination and similar chemical environment of Fe(III) ions in the elastomers. The coordination bonds dissipated energy, and the chemical cross-linking maintained the networks; they enhanced tensile strength jointly. The elastomers demonstrated favorable self and shape recoverability due to the dynamic reversibility of the coordination bonds and the stress of the chemical cross-linking in the reshaped elastomers. Such elastomers could be used as intelligent and sustainable materials. Moreover, the materials exhibited good biocompatibility and can be utilized as a type of cell adhesive in bioimaging.

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Section: Resultsmentioning

confidence: 83%

Section: Introductionmentioning

confidence: 99%

Self-Recoverable Dual-Network Silicon Elastomer Applied in Cell Adhesives

Wang³

et al. 2019

ACS Appl. Polym. Mater.

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“…[ 59 ] The type of bonding of constituents and the nature of longitudinal and transverse lattice vibrations (phonons) in composites also influence the specific heat. [ 35 ] The HGM addition increases the quantity of light gas, which has very low heat capacity, resulting in lower specific heat in composites with higher HGM content. [ 60 ] A similar decrease in the specific heat of composite with an increase in HGM content was observed by other researchers in non‐phenolic matrix‐based composites.…”

Section: Resultsmentioning

confidence: 99%

Thermophysical properties of hybrid silica phenolic ablative composite: Theoretical and experimental analysis

Panigrahi

Sasikumar

et al. 2022

Polymer Composites

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Silica phenolic ablative composites are used in many high‐temperature applications like rocket/missile solid motor nozzles, space re‐entry vehicles, and so forth. As ablative composite with lower thermal conductivity and density can save considerable cost, a hybrid silica phenolic ablative composite was developed by establishing a novel processing methodology using chopped silica fiber, phenolic resin, and hollow glass microsphere. The thermophysical properties of the developed hybrid composite are analyzed and established the scientific know‐how. The developed composites, with 36% lower density, displayed 50% lower thermal conductivity and 50% lower thermal diffusivity than standard silica phenolic composite. Since a proper thermal conductivity model for a three‐component composite with matrix, fiber, and hollow glass microsphere is not available, the most suitable model for the developed composite is established.

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“…[37] Moreover, BIPB is more effective in improving 1,2‐PB/EPDM/SBS composite cross‐link density due to its higher activity than DCP. The heat resistance index ( T HR ), showing the appropriate temperature for the long‐term use of the composites, is expressed by the following formula[38,39]:

T_{HR} = 0.49 ([], T_{5} + 0.6 ((), T_{30} - T_{5}))

…”

Section: Resultsmentioning

confidence: 99%

Different Organic Peroxides that Cure Low‐k 1,2‐PB/SBS/EPDM Composites for High‐Frequency Substrate

Mao

Wang

et al. 2020

Vinyl Additive Technology

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Since the advent of 5G network, polymeric low dielectric constant (low‐k) materials have been indispensable for high speed and stable signal transmission at microwave frequency. Herein, the low‐k composites of 1,2‐polybutadiene/styrene‐butadiene‐styrene triblock copolymer/ethylene‐propylene‐dicyclopentadiene (1,2‐PB/SBS/EPDM) were prepared with cured organic peroxide. Two structurally different organic peroxides, namely dicumyl peroxide (DCP) and bis(1‐(tert‐butylperoxy)‐1‐methylethyl)‐benzene (BIPB), were used as free‐radical initiators. The composites with highly efficient initiator—BIPB exhibited considerably enhanced conversion rate, thermal stability, and cross‐link density compared with the DCP system. Furthermore, the increased cross‐link density contributed to dielectric stability over a broad range of frequency (3‐15 GHz) and superior mechanical properties. The cross‐linked composites possessed the typical low polarity group of C─C single bond with suppressed dielectric constant (Dk) and loss (Df). Especially, the average Dk of 2.36 and average Df of 0.0054 were obtained for the composite containing 4 part‐by‐weight (pbw) BIPB. This work demonstrated that the 1,2‐PB/SBS/EPDM composite with 4 pbw BIPB is a good candidate for high‐frequency substrate materials.

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Addition-cure, room temperature vulcanizing silicone elastomer based syntactic foams with glass and ceramic microballoons

Cited by 11 publications

References 34 publications

Self-Recoverable Dual-Network Silicon Elastomer Applied in Cell Adhesives

Self-Recoverable Dual-Network Silicon Elastomer Applied in Cell Adhesives

Thermophysical properties of hybrid silica phenolic ablative composite: Theoretical and experimental analysis

Different Organic Peroxides that Cure Low‐k 1,2‐PB/SBS/EPDM Composites for High‐Frequency Substrate

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