2013
DOI: 10.4028/www.scientific.net/amm.288.241
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Adaptive Slicing Algorithm Based on STL Model

Abstract: An adaptive slicing algorithm based on stereo lithography (STL) model was proposed in order to improve the forming precision of product in rapid prototyping. In the algorithm, the topological information of STL model was established, and the relationship between triangle facet and vertexes was constructed. And the adaptive slicing process based on STL model was implemented using the proposed method with combination of intersection points tracking and marking. The slicing thickness was automatically calculated … Show more

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Cited by 9 publications
(6 citation statements)
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References 4 publications
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“…The triangle facets stored in the STL model are disordered, representing that it is not able to provide the algorithm with topological relationships between geometries when used as input. Therefore, Pan et al [13] proposed an adaptive slicing algorithm to construct associations between triangles and their vertices in the triangle mesh. Zhang et al [14] use a hash table to build the overall topology of the STL model in advance and reduce the slice search range by establishing a slice relation matrix.…”
Section: Related Workmentioning
confidence: 99%
“…The triangle facets stored in the STL model are disordered, representing that it is not able to provide the algorithm with topological relationships between geometries when used as input. Therefore, Pan et al [13] proposed an adaptive slicing algorithm to construct associations between triangles and their vertices in the triangle mesh. Zhang et al [14] use a hash table to build the overall topology of the STL model in advance and reduce the slice search range by establishing a slice relation matrix.…”
Section: Related Workmentioning
confidence: 99%
“…Typically, layer thickness is constant during the slicing process; however, there are a number of examples for adaptive slicing [16][17][18] where the layer height is decreased when slicing regions of high detail or increased when there are less geometric features to be captured. These methods can increase the efficiency of the slicing process; however, use is only appropriate where one model is produced per build cycle.…”
Section: Review Of Related Workmentioning
confidence: 99%
“…The productivity of step-and-scan lithography depends on the particulars of the specified trajectory to be followed for wafer stage and reticle stage [10,[15][16]. At the point of high productivity and high accuracy positioning two conflicting requirements have to be met.…”
Section: Formulation Of the Scanning Trajectorymentioning
confidence: 99%
“…On the other hand, there is a requirement to be met relating to limitations of control equipment used for positioning the stages with sufficient accuracy and stability. For balancing these conflicting requirements in an appropriate way and from the point of motion positioning accuracy, stability and the smoothness of a motion trajectory, the trajectories of scan movement and step movement both adopt the third-order polynomial curve [11][12][13][14][15][16].According to the optimization method of wafer exposure route [9], the typical scenario of continuous exposure scanning path for step-and-scan lithography is shown in Fig. 1.…”
Section: Formulation Of the Scanning Trajectorymentioning
confidence: 99%
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