Adaptive Body Biasing Circuit for Reliability and Variability Compensation of a Low Power RF Amplifier

Analysis of the impact of prototyping‐related parasitic effects in a hybrid GaN power amplifier for 5G FR1 applications

“…Also, the spacing of the transistors and the overall larger circuit size often allow for better heat dissipation thus limiting the temperature sensitivity of the amplifier. On the contrary, the production process of monolithic integrated circuits is more repeatable, although affected by a certain amount of variability, but it allows little or no tuning after manufacturing 32,33 and is typically more sensitive to temperature variations due to the high power density per chip area and the more challenging heat dissipation. The complexity of the architecture, that is, the number of active devices, the presence of integrated driver stages, the spatial proximity of the active devices 34,35 and the presence or absence of isolating elements among them, has also an impact on its sensitivity.…”