Active Thermal Control for Hybrid Modular Multilevel Converter Under Overmodulation Operation

Sheng, Jiajing; Yang, Heya; Li, Chushan; Chen, Min; Li, Wuhua; He, Xiangning; Gu, Xiuquan

doi:10.1109/tpel.2019.2936010

Cited by 29 publications

(9 citation statements)

References 31 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Although the temperature among SMs was balanced, a distorted multilevel arm voltage waveform was produced from unbalanced capacitor voltages. In [118], the study revealed that thermal stress distribution inside the SMs of hybrid MMC (Figure 23) becomes more unbalanced under a high voltage modulation index. The ATC for both halfbridge SMs (HBSMs) and full-bridge SMs (FBSMs) was proposed to solve this problem.…”

Section: Cascaded Converter Systemmentioning

confidence: 99%

“…The positive arm current will be bypassed by the thyristor to reduce the thermal stress on the lower IGBT. The utilization of a parallel thyristor in HBSM is also applied In [118], the study revealed that thermal stress distribution inside the SMs of hybrid MMC (Figure 23) becomes more unbalanced under a high voltage modulation index. The ATC for both half-bridge SMs (HBSMs) and full-bridge SMs (FBSMs) was proposed to solve this problem.…”

Section: Cascaded Converter Systemmentioning

confidence: 99%

“…The ATC for both half-bridge SMs (HBSMs) and full-bridge SMs (FBSMs) was proposed to solve this problem. As for FBSMs, the two kinds of bypassed switching modes were altered to form a symmetrical switching arrangement when arm voltage is positive [118]; as shown in Figure 24, the same procedure is applied when arm voltage is negative. The symmetrical switching arrangement does not deteriorate the converter output performance, whereas the distribution of power losses in FBSM is more balanced, resulting in the thermal reduction of the most stressed devices.…”

Section: Cascaded Converter Systemmentioning

confidence: 99%

See 2 more Smart Citations

Enhance Reliability of Semiconductor Devices in Power Converters

Nguyen¹,

Kwak²

2020

Electronics

View full text Add to dashboard Cite

As one of the most vulnerable components to temperature and temperature cycling conditions in power electronics converter systems in these application fields as wind power, electric vehicles, drive system, etc., power semiconductor devices draw great concern in terms of reliability. Owing to the wide utilization of power semiconductor devices in various power applications, especially insulated gate bipolar transistors (IGBTs), power semiconductor devices have been studied extensively regarding increasing reliability methods. This study comparatively reviews recent advances in the area of reliability research for power semiconductor devices, including condition monitoring (CM), active thermal control (ATC), and remaining useful lifetime (RUL) estimation techniques. Different from previous review studies, this technical review is carried out with the aim of providing a comprehensive overview of the correlation between various enhancing reliability techniques and discussing the corresponding merits and demerits by using 144 related up-to-date papers. The structure and failure mechanism of power semiconductor devices are first investigated. Different failure indicators and recent associated CM techniques are then compared. The ATC approaches following the type of converter systems are further summarized. Furthermore, RUL estimation techniques are surveyed. This paper concludes with summarized challenges for future research opportunities regarding reliability improvement.

show abstract

Section: Cascaded Converter Systemmentioning

confidence: 99%

Section: Cascaded Converter Systemmentioning

confidence: 99%

Section: Cascaded Converter Systemmentioning

confidence: 99%

See 1 more Smart Citation

Enhance Reliability of Semiconductor Devices in Power Converters

Nguyen¹,

Kwak²

2020

Electronics

View full text Add to dashboard Cite

show abstract

“…According to [24], for a hybrid MMC with DC fault riding through ability, the FBSM proportion should satisfy the following inequality.…”

Section: Proposed Hybrid MMC Topologymentioning

confidence: 99%

MMC-MTDC transmission system with partially hybrid branches

Chen

Pan

Huang

et al. 2021

Trans. Electr. Mach. Syst.

View full text Add to dashboard Cite

This paper proposes a hybrid submodule modular multilevel converter (MMC) topology which is suitable for multi terminal direct current (MTDC) transmission systems. Each arm of the proposed MMC topology consists of a half-bridge submodule (HBSM) branch and two parallel full-bridge submodule (FBSM) branches. Comparing with the conventional MTDC transmission system, the proposed topology can selectively block the DC fault current and isolate the corresponding fault line without expensive DC circuit breakers (DCCBs). Thus, the influence range of the DC fault can be reduced and the reliability of the power supply can be improved as well. The corresponding modulation and voltage balancing strategies are developed for the proposed hybrid MMC topology. The feasibility of the proposed topology and control strategy is verified in the MATLAB/ Simulink simulation. Index Terms-Hybrid modular multilevel converter, multi terminal networks, high voltage dc (HVDC) transmission.

show abstract

“…Reference [8] presents a halfbridge SM topology with an additional antiparallel diode, which can reduce the thermal stress of the bottom diode in MMCs. References [9]- [10] introduces a SM topology with the bypass thyristor at the low side, which can reduce the thermal stress of the bottom IGBT/diode in MMCs. However, the SM design optimization-based method would complicate the hardware design.…”

Section: Introductionmentioning

confidence: 99%

Thermal Optimization Strategy Based on Second-Order Harmonic Circulating Current Injection for MMCs

Zhao

Deng

et al. 2021

IEEE Access

View full text Add to dashboard Cite

Thermal management is one of the most significant challenges for reliability improvement of modular multilevel converters (MMCs). The thermal stress difference caused by the uneven loss distribution between top and bottom IGBTs/diodes will lead to lifetime difference of the IGBTs/diodes which will decrease the reliability of the MMC. In this paper, a thermal optimization strategy for MMCs is proposed, where the maximum thermal stress in the IGBT/diode of each SM can be effectively reduced through injecting optimum second-order harmonic current into the circulating current of MMCs, and accordingly the lifetime of MMCs can be improved by the proposed strategy. Detailed simulation results with PSCAD software and experimental results with 3kW MMC platform are provided to confirm the validity of the proposed thermal optimization strategy for MMCs. INDEX TERMSCirculating current injection, Modular multilevel converters, lifetime, thermal optimization.

show abstract

Active Thermal Control for Hybrid Modular Multilevel Converter Under Overmodulation Operation

Cited by 29 publications

References 31 publications

Enhance Reliability of Semiconductor Devices in Power Converters

Enhance Reliability of Semiconductor Devices in Power Converters

MMC-MTDC transmission system with partially hybrid branches

Thermal Optimization Strategy Based on Second-Order Harmonic Circulating Current Injection for MMCs

Contact Info

Product

Resources

About