2015
DOI: 10.1117/12.2180641
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Achieving zero stress in iridium, chromium, and nickel thin films

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Cited by 16 publications
(16 citation statements)
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“…However, the integrated stress changes as the deposited thickness changes, at a rate of −2.8 to −4 N∕m∕nm, depending on the deposition pressure. 6 This implies that a small variation in thickness across a mirror would result in varying integrated stress. For example, a AE1% thickness variation (as measured by Mori et al 9 ) on a nominal 15 nm film would result in a variation in integrated stress of AE0.4 to AE0.6 N∕m.…”
Section: Nonuniform Integrated Stressmentioning
confidence: 99%
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“…However, the integrated stress changes as the deposited thickness changes, at a rate of −2.8 to −4 N∕m∕nm, depending on the deposition pressure. 6 This implies that a small variation in thickness across a mirror would result in varying integrated stress. For example, a AE1% thickness variation (as measured by Mori et al 9 ) on a nominal 15 nm film would result in a variation in integrated stress of AE0.4 to AE0.6 N∕m.…”
Section: Nonuniform Integrated Stressmentioning
confidence: 99%
“…This paper is restricted to the investigation of film stress effects on the shape of segmented silicon mirrors. To produce an x-ray mirror segment, a silicon substrate must be fabricated 5 and then coated, typically with a thin metal film, such as iridium [6][7][8][9] or a multilayered coating, [10][11][12] to efficiently reflect x-rays. Coatings are often deposited using magnetron sputtering, usually to maximize x-ray reflectivity, which results in a stressed film that deforms the thin mirror substrates, especially segmented mirrors.…”
Section: Introductionmentioning
confidence: 99%
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“…5 (2) the argon pressure to achieve a stress reduction of nearly three orders of magnitude in iridium films, while also maintaining the surface roughness within acceptable limits for soft x-ray reflectivity. 15 The stress evolution in polycrystalline metal films, such as iridium, can be associated with various features of film growth including nucleation, island growth, and island coalescence. The film stress reaches a tensile maximum during coalescences and then passes through zero stress before reaching a compressive steady state.…”
Section: Coatingsmentioning
confidence: 99%
“…According to Broadway et al [29] the sputtering pressure is a relevant parameter influencing the intrinsic stress of coating. Coating experiments were therefore performed using different sputtering pressures to investigate the influence of this parameter on the film properties.…”
Section: A Coating Methodsmentioning
confidence: 99%