2021
DOI: 10.1126/science.abc4174
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Achieving large uniform tensile elasticity in microfabricated diamond

Abstract: Diamond is not only the hardest material in nature, but is also an extreme electronic material with an ultrawide bandgap, exceptional carrier mobilities, and thermal conductivity. Straining diamond can push such extreme figures of merit for device applications. We microfabricated single-crystalline diamond bridge structures with ~1 micrometer length by ~100 nanometer width and achieved sample-wide uniform elastic strains under uniaxial tensile loading along the [100], [101], and [111] directions at room temper… Show more

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Cited by 113 publications
(58 citation statements)
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“…Advanced nanoscale synthesis and characterization techniques have produced high-quality specimens and tested mechanical properties [62][63][64][65][66][67], and these techniques are also well equipped to operate at cryogenic conditions for versatile physical property measurements at extremely low temperatures [68][69][70], making experimental verification of our predicted results feasible.…”
Section: Discussionmentioning
confidence: 99%
“…Advanced nanoscale synthesis and characterization techniques have produced high-quality specimens and tested mechanical properties [62][63][64][65][66][67], and these techniques are also well equipped to operate at cryogenic conditions for versatile physical property measurements at extremely low temperatures [68][69][70], making experimental verification of our predicted results feasible.…”
Section: Discussionmentioning
confidence: 99%
“…However, the measured strain is quite small, in the order of 0.01%. Recently, a large and uniform elasticity of the single-crystal diamond NW of 1-mm-long by around 100-nm-wide has been reported, achieving a tensile strain of up to 9.7% [125]. Based on the researchers' spectroscopy analysis, a reduction of 2 eV in the diamond band structure was observed under such a large elastic strain.…”
Section: Discussion and Outlookmentioning
confidence: 99%
“…光电子、 量子芯片以及芯片散热的基础性材料之一 [9] . 然而随着电路中的电子元器件尺寸达到微纳量级 [10] , 尺寸效应将极大影响金刚石的散热特性, 因此, 对金 刚石热导率进行跨尺度分析有利于微纳电子元器件 的设计和热管理.…”
Section: -2unclassified