Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Abstract

In this work, a sinusoidal vibration test method with resonance tracking is employed for reliability testing of circuit assemblies. The system continuously monitors for changes in the resonant frequency of the circuit board and adjusts the excitation frequency to match the resonant frequency. The test setup includes an electrodynamic shaker with a real-time vibration control, resistance monitoring for identifying electrical failures of interconnects, and vibration logging for monitoring changes in the dynamic response of the assembly over time. Reliability tests were performed using the resonance tracking sinusoidal test method for assemblies, each consisting of a centrally mounted ball grid array (BGA) device assembled with 63Sn37Pb and SAC105 solder alloys. These tests show that the resonance tracking method gives more consistent failure times. Failure analysis for the tested devices shows the primary failure mode is “input” trace crack first, followed by fatigue through the solder for complete failure. A finite element (FE) model, correlated with experimental modal analysis, is shown to accurately estimate the circuit board deflection estimated from the harmonic vibration data. This provides a means of estimating the stresses in the electronic interconnections while accounting for the variability between test parts. These fine-tuned vibration measurement techniques and related FE models provide the building blocks for high cycle solder fatigue plots (i.e., S–N curves).

Experimental and numerical fatigue life assessment of SAC305 solders subjected to combined temperature and harmonic vibration loadings

“…For solder failure detection, an Analysis Tech 256STD (Analysis Tech, Wakefield, Massachusetts, USA) standard event detector was combined with an Agilent 34980 A resistance logger to monitor solder resistance changes using Benchlink Data Logger Software. For further information on this test, readers are strongly encouraged to refer to reference (Su et al , 2018). The schematic of this test setup is shown in Figure 3.…”

“…For vibration reliability assessment, several experimental (Su et al , 2018; Su et al , 2014; Yu et al , 2011; Gharaibeh, 2018), numerical studies via finite element analysis (FEA) simulations (Gharaibeh, 2018; Xia et al , 2017; Xia et al , 2017) and analytical methods (Gharaibeh et al , 2016; Gharaibeh, 2018; Gharaibeh, 2018; Gharaibeh et al , 2018; Gharaibeh et al , 2017; Gharaibeh and Pitarresi, 2019) have been developed. Also, the reliability of electronic assemblies under thermal cycling has been widely discussed (Joshi et al , 2012; Obaidat et al , 2016; Chang et al , 2006; Barker et al , 1990; Barker et al , 1991; Barker et al , 1991).…”

Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys

“…The new driving frequency is the resonant frequency of the system which has drifted due to some change in the material of the assembly. For further information on this test, readers are strongly encouraged to refer to reference (Su et al , 2018).…”

“…Electronics nowadays come in smaller, thinner and lighter specifications, and they can be found in different applications, for example, computers, laptops and handheld devices. Therefore, extensive experimental (Chen et al , 2008; Su et al , 2018; Su et al , 2014), numerical (Gharaibeh, 2018a; Xia et al , 2017a; Xia et al , 2017b; Gharaibeh, 2018c) and analytical (Obaidat et al , 2016; Gharaibeh, 2018b; Gharaibeh et al , 2017; Gharaibeh et al , 2018) methodologies were developed to study and evaluate the reliability of critical components.…”

Application of continuum damage mechanics to vibration fatigue life prediction

“…According to the literature, an effective method to track the resonant frequency is the auto-phase SRTD test using the phase difference between the signals from 2 sensors. [21][22][23] The reference accelerometer is attached to the fixer of the cantilever beam, whereas the response accelerometer is attached to the end of the beam. A sine sweep test is conducted first to obtain the resonant frequency, at which the response accelerometer reaches its peak.…”