Accelerated mechanical low cycle fatigue in isothermal solder interconnects

Marbut, Cody J.; Nafis, Bakhtiyar Mohammad; Huitink, David

doi:10.1016/j.microrel.2020.113998

Cited by 7 publications

(4 citation statements)

References 12 publications

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“…Prior works have demonstrated that the development of novel accelerated testing methods for addressing specific failure mechanisms can decrease testing times while still delivering lifetime prediction accuracy [13][14][15][16]. Therefore, well-designed accelerated testing processes and results can be leveraged for reliability estimation.…”

Section: Motivationmentioning

confidence: 99%

Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules

Huitink,

Vinson,

Ruby

et al. 2023

Journal of Microelectronics and Electronic Packaging

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As power densification demands are placing electronic packages under greater reliability risk, the consequences of complementary or interacting stresses in producing failure are becoming increasingly significant. As such, it is important that reliability methods and package designs consider how multiplestress interactions may impact product life. Here, the coordination between a novel accelerated testing method and electronic design automation efforts has demonstrated a successful optimization approach for a wire-bonded 2D module layout combining failure mechanisms of electromigration and mechanical stressing. Utilizing custom, physics-of-failure approaches in accelerated testing, interactions can be observed in failure acceleration, which then can be incorporated into design for reliability (DfR) optimization tools. The PowerSynth 2 platform has been utilized as a DfR tool to perform a rapid reliability evaluation incorporating multistress scenarios. This work demonstrates the value added to reliability evaluation techniques when accounting for interacting failure mechanisms and suggests that next-generation power devices consider these effects in lifetime estimation.

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Section: Motivationmentioning

confidence: 99%

Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules

Huitink,

Vinson,

Ruby

et al. 2023

Journal of Microelectronics and Electronic Packaging

View full text Add to dashboard Cite

show abstract

“…Prior works have demonstrated that the development of novel accelerated testing methods for addressing specific failure mechanisms can decrease testing times while still delivering lifetime prediction accuracy [12]- [15]. Therefore, well-designed accelerated testing processes and results can be leveraged for reliability estimation.…”

Section: Motivationmentioning

confidence: 99%

Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules

Huitink,

Vinson,

Ruby

et al. 2023

IMAPSource Proceedings

View full text Add to dashboard Cite

As power densification demands are placing electronic packages under greater reliability risk, the consequence of complementary or interacting stresses in producing failure are becoming increasingly significant. As such, it is important that reliability methods and package designs consider how multiple-stress interactions may impact product life. Here, the coordination between a novel accelerated testing method and electronic design automation efforts has demonstrated a successful optimization approach for a wire-bonded 2D module layout combining failure mechanisms of electromigration and mechanical stressing. Utilizing custom, physics-of-failure approaches in accelerated testing, interactions can be observed in failure acceleration, which then can be incorporated into design for reliability (DfR) optimization tools. The PowerSynth 2 platform has been utilized as a design for reliability tool to perform a rapid relative reliability evaluation incorporating multi-stress scenarios. This work demonstrates the value added to reliability evaluation techniques when accounting for interacting failure mechanisms and suggests that next generation power devices consider these effects in lifetime estimation.

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“…Delamination failure is a low-cycle ratchet fatigue failure of the different material layers of the encapsulated device under various severe working conditions, such as high temperature, temperature cycling, and humidity, which is manifested by repeated thermal expansion and contraction, and hot and humid stress attacks [ 6 , 7 ]. Researchers’ studies on delamination mechanisms have mainly focused on thermal stress damage and moisture damage.…”

Section: Introductionmentioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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Accelerated mechanical low cycle fatigue in isothermal solder interconnects

Cited by 7 publications

References 12 publications

Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules

Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules

Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules

Delamination of Plasticized Devices in Dynamic Service Environments

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