Absorption and diffusion of water in printed circuit boards

Zecha, Heiner; Fruh, Christiane; Ratchev, R.; Biehl, E.; Zerna, Thomas

doi:10.1109/isse.2013.6648227

Cited by 4 publications

(3 citation statements)

References 3 publications

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“…Recent literature works report that the weaker spots in high-power semiconductor modules are the trenches in between the metallization edges and ceramic substrates [5,[25][26][27]. These physical defects can be easily identified using a modern PD detection method and PRPD-based pattern analysis [5].…”

Section: Partial Discharges In Liquid and Gel Materialsmentioning

confidence: 99%

“…These conditions are inadequate as the modules and converters are applied in lower-or higher-pressure environments. In this context, the application of liquid-and gel-based dielectric materials become a necessity to provide electrical insulation and to offer a pressure-neutral solution [4,24,26,27]. Experiments on specific dielectric materials have indicated that their application increases the breakdown and partial discharge characteristics of the modules and power converters [2,4].…”

Section: Partial Discharges In Liquid and Gel Materialsmentioning

confidence: 99%

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Influence of Water Ingress on Surface Discharges Occurring on the Silicone Gel Encapsulated Printed Circuit Boards Developed for Deep-Sea Applications

Arumugam

Haba

et al. 2023

Energies

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This paper discusses the influence of water ingress on the electrical discharges that arise on the surface of printed circuit boards that are developed for deep sea applications. The primary concern is the electrical discharges arising on the surface of the PCB bridging localized spots/areas between conductive traces, high voltage terminal, mounting hole options, and so on. The current literature focuses on electrical discharges arising on the surface of PCB at low-pressure environments emulating aircraft and space applications. Extending the same approach to deep-sea environments is not feasible since the pressure is very high and the temperatures are very low. In all, a meager attempt has been made to investigate the possible application of such gel-encapsulated PCBs in adverse high-pressure, salt/sea water, low-temperature, deep-sea environments. This experimental study focuses on studying the influence of deionized and sea water on electrical discharges arising on the surface, between conductive tracks of PCB. A group of PCBs with different gaps between the conductive tracks was produced and immersed in deionized and seawater for a specific duration at standard pressure. Afterward, the discharge characteristics were measured the using partial discharge (PD) test method and the respective phase-resolved PD pattern was studied and analyzed. Pertinent experiments revealed that the PD process and eventual failure manifests as a typical and substantial pattern. The apparent charge measured during the PD inception and near-by failure condition, influenced by deionized and seawater, reveals a regular trend. Naturally, a simple observation of the PD pattern might help to identify the intricacy and to initiate a preventive measure well before the complete system suffers a premature failure. Also, based on these results, making slight structural modifications on the PCB at crucial locations might help in retaining the dielectric integrity of the material.

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Section: Partial Discharges In Liquid and Gel Materialsmentioning

confidence: 99%

Section: Partial Discharges In Liquid and Gel Materialsmentioning

confidence: 99%

Influence of Water Ingress on Surface Discharges Occurring on the Silicone Gel Encapsulated Printed Circuit Boards Developed for Deep-Sea Applications

Arumugam

Haba

et al. 2023

Energies

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“…Therefore, the use of polymer material for electronic enclosure increases the chance of moisture penetration due to the possibility of water molecules passing through the material and acting as a buffer for moisture content. Literature focuses mainly on the moisture absorption by laminates, plastic, and mould compounds [11][12][13][14][15][16][17][18][19]. Although the effect of humidity on the properties of components [20][21][22] has been investigated, studies related to the humidity ingress into electronic enclosures are limited [23][24], while other works focus on temperature performance [25][26].…”

Section: Introductionmentioning

confidence: 99%

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil-Gudla

Staliulionis

Jellesen

et al. 2017

IEEE Trans. Compon., Packag. Manufact. Technol.

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Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices from humidity is becoming a critical factor in the system design. The ingress of moisture into typical electronic enclosures has been studied with defined parameters such as openings in the enclosure (drain holes, intentional openings or leak), and sealing and casing material. Related corrosion reliability issues due to humidity build-up have been evaluated using an interdigitated surface insulation resistance (SIR) pattern placed inside the enclosure during exposure. The moisture build-up inside the enclosure has been simulated using an equivalent RC circuit consisting of variables like controlled resistors and capacitors to describe the diffusivity, permeability, and storage in polymers.

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Basic theory of corrosion and important failure mechanisms connected to corrosion in electronics

Ambat¹,

Piotrowska²

2022

Humidity and Electronics

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Absorption and diffusion of water in printed circuit boards

Cited by 4 publications

References 3 publications

Influence of Water Ingress on Surface Discharges Occurring on the Silicone Gel Encapsulated Printed Circuit Boards Developed for Deep-Sea Applications

Influence of Water Ingress on Surface Discharges Occurring on the Silicone Gel Encapsulated Printed Circuit Boards Developed for Deep-Sea Applications

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Basic theory of corrosion and important failure mechanisms connected to corrosion in electronics

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