Abscheidung von Palladium und Palladiumlegierungen mit hohen Schichtdicken für die Mikrosystemtechnik

Abstract

Layers of metals and alloys deposited in microstructures usually require to be thicker than the 100 lm which is the approximate height of the structure. The deposited form of noble metals used in microsystems must be non-stressed, ductile and free of cracks and pores. As the thickness of layers deposited from commercial noble metal electrolytes will rarely exceed 10 lm without loss of quality, developing an electrolyte system suitable for microsystems involves finding appropriate additives and deposition parameters. Details are given of deposit characterisation, the parameters of the deposition technology and some practical examples. Initial results are presented and discussed.

Status quo und Trends der Galvanotechnik

“…Zu den typischen Beschichtungsmetallen zählen Zink und Zinklegierungen, auf die wertbezogen etwa 40 [15,16,17].…”