2008
DOI: 10.1109/jssc.2008.922385
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A Wideband Millimeter-Wave Power Amplifier With 20 dB Linear Power Gain and +8 dBm Maximum Saturated Output Power

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Cited by 31 publications
(11 citation statements)
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(22 reference statements)
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“…In the amplifiers implemented here, a gain per stage of 6. gain-bandwidth product amplifiers that are designed in various Si CMOS and SiGe BiCMOS processes (see [1] and [17] and [19]- [27]). Note that these distributed amplifiers are optimized based on transistor size, number of stages, and transmission line dimensions to achieve the largest possible bandwidths or gain-bandwidth products.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…In the amplifiers implemented here, a gain per stage of 6. gain-bandwidth product amplifiers that are designed in various Si CMOS and SiGe BiCMOS processes (see [1] and [17] and [19]- [27]). Note that these distributed amplifiers are optimized based on transistor size, number of stages, and transmission line dimensions to achieve the largest possible bandwidths or gain-bandwidth products.…”
Section: Discussionmentioning
confidence: 99%
“…Si and SiGe RF and microwave integrated circuits often use shielded microstrip-mode CPW lines and shielded inductors to provide isolation of these components from the Si substrate in which the underlying ground plane prevents the electromagnetic field from penetrating the lossy substrate [17]- [20]. In order to investigate if shielding can provide additional substrate isolation in this mask programmable technology, we have performed HFSS simulation of -parameters of a CPW line with a ground plane underneath, as shown in Fig.…”
Section: A Cpw Transmission Linesmentioning
confidence: 99%
“…F OR millimeter-wave integrated amplifier design, the gain and efficiency, which have been limited by the low supply voltage of submicrometer CMOS processes [1], have been gradually increased using new design techniques [2]- [5]. To obtain high output power, the distributed-active-transformerbased CMOS power amplifier (PA) combines multiple power units, and new output power records have been achieved [6]- [9].…”
Section: Introductionmentioning
confidence: 99%
“…The major limitations in sub-micron CMOS technology are the low breakdown voltage, high substrate loss, and low power density. Recently, a number of 60 GHz PAs were reported, with the highest output power below 12.3 dBm, power gain below 20 dB, and limited bandwidth [12]- [17].…”
Section: Introductionmentioning
confidence: 99%