1994
DOI: 10.1109/66.330278
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A vision system for inspection of ball bonds and 2-D profile of bonding wires in integrated circuits

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Cited by 22 publications
(16 citation statements)
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“…Most online chip inspection systems use optical analysis, including laser light (Kimura and Iyanaga 1986, Kimura and Kamashita 1988, Kimura 1990), infrared ray inspection, microscope image matching (Yoda et al 1988, Maeda et al 1990, Tsukahara et al 1992, or a more general image inspection method (Chapman et al 1990, Sreeninasan et al 1993, Khotanzad et al 1994. Sreenivasan et al (1993) proposed a method for pre-bonding and post-bonding inspection.…”
Section: Introductionmentioning
confidence: 99%
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“…Most online chip inspection systems use optical analysis, including laser light (Kimura and Iyanaga 1986, Kimura and Kamashita 1988, Kimura 1990), infrared ray inspection, microscope image matching (Yoda et al 1988, Maeda et al 1990, Tsukahara et al 1992, or a more general image inspection method (Chapman et al 1990, Sreeninasan et al 1993, Khotanzad et al 1994. Sreenivasan et al (1993) proposed a method for pre-bonding and post-bonding inspection.…”
Section: Introductionmentioning
confidence: 99%
“…Although vision-based inspection systems have been introduced in various stages of IC manufacturing (Kimura and Iyanaga 1986, Kimura and Kamashita 1988, Yoda et al 1988, Chapman et al 1990, Kimura 1990, Maeda et al 1990, Tsukahara et al 1992, Sreenivasan et al 1993, Khotanzad et al 1994, Wu et al 1996, Wang et al 1997, there has been little attempt at wire bond inspection.…”
Section: Introductionmentioning
confidence: 99%
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“…Recently the vision system has been gradually applied to increase and improve the measurement accuracy of the CMM [4][5][6]. In actual, the vision system has been widely used to inspect a wide variety of components or parts manufactured in industry [7][8][9][10]. The inspection accuracy of the vision system can be promoted by using a camera with a high magnification lens.…”
Section: Introductionmentioning
confidence: 99%
“…There are published algorithms in the literature that deal with this type of inspection (Khotanzad et al, 1994;Ngan and Kang, 1988;Tsukahara et al, 1993). However, for the detection of lifted, tight, and sagging wires, three-dimensional (3D) profiles of bonded wires need to be examined.…”
Section: Introductionmentioning
confidence: 99%