A vision system for inspection of ball bonds and 2-D profile of bonding wires in integrated circuits

Khotanzad, A.; Banerjee, Hritwick; Srinath, M

doi:10.1109/66.330278

Cited by 22 publications

(16 citation statements)

References 7 publications

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“…Most online chip inspection systems use optical analysis, including laser light (Kimura and Iyanaga 1986, Kimura and Kamashita 1988, Kimura 1990), infrared ray inspection, microscope image matching (Yoda et al 1988, Maeda et al 1990, Tsukahara et al 1992, or a more general image inspection method (Chapman et al 1990, Sreeninasan et al 1993, Khotanzad et al 1994. Sreenivasan et al (1993) proposed a method for pre-bonding and post-bonding inspection.…”

Section: Introductionmentioning

confidence: 99%

“…Although vision-based inspection systems have been introduced in various stages of IC manufacturing (Kimura and Iyanaga 1986, Kimura and Kamashita 1988, Yoda et al 1988, Chapman et al 1990, Kimura 1990, Maeda et al 1990, Tsukahara et al 1992, Sreenivasan et al 1993, Khotanzad et al 1994, Wu et al 1996, Wang et al 1997, there has been little attempt at wire bond inspection.…”

Section: Introductionmentioning

confidence: 99%

“…In addition, they used morphological operations to check the connection of wires. Khotanzad et al (1994) used top views of the IC chip to inspect the wire connections. They ®rst segmented the region of bond wires from the image.…”

Section: Introductionmentioning

confidence: 99%

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Automated post bonding inspection by using machine vision techniques

Wang¹,

Wu²,

Hsu³

2002

International Journal of Production Research

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Inspection plays an important role in the semiconductor industry. In this paper, we focus on the inspection task after wire bonding in packaging. The purpose of wire bonding (W/B) is to connect the bond pads with the lead ®ngers. Two major types of defects are (1) bonding line missing and (2) bonding line breakage. The numbers of bonding lines and bonding balls are used as the features for defect classi®cation. The proposed method consists of image preprocessing, orientation determination, connection detection, bonding line detection, bonding ball detection, and defect classi®cation. The proposed method is simple and fast. The experimental results show that the proposed method can detect the defects e ectively.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Automated post bonding inspection by using machine vision techniques

Wang¹,

Wu²,

Hsu³

2002

International Journal of Production Research

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“…Recently the vision system has been gradually applied to increase and improve the measurement accuracy of the CMM [4][5][6]. In actual, the vision system has been widely used to inspect a wide variety of components or parts manufactured in industry [7][8][9][10]. The inspection accuracy of the vision system can be promoted by using a camera with a high magnification lens.…”

Section: Introductionmentioning

confidence: 99%

Application of computer vision and laser interferometer to the inspection of line scale

Luo

Pan

Chu

2004

Optics and Lasers in Engineering

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“…There are published algorithms in the literature that deal with this type of inspection (Khotanzad et al, 1994;Ngan and Kang, 1988;Tsukahara et al, 1993). However, for the detection of lifted, tight, and sagging wires, three-dimensional (3D) profiles of bonded wires need to be examined.…”

Section: Introductionmentioning

confidence: 99%

A stereo vision system for the inspection of IC bonding wires

Ong

Han

2000

Int J Imaging Syst Tech

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ABSTRACT:We describe a novel inspection system based on the application of the stereo technique to the detection of defects related to the three-dimensional (3D) profile of IC wire bonds. In our singlecamera-based setup, stereo views are obtained by rotating the IC chip under the CCD camera with a telecentric lens. The edges of the wires are detected using Petrou's line filter and the facet model applied to obtain subpixel edge localization. After linking edges to form meaningful curves, stereo matching is conducted between the two curve lists of a stereo pair. The height profiles of the wire bonds are obtained using the disparity equation derived from the imaging geometry.

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A vision system for inspection of ball bonds and 2-D profile of bonding wires in integrated circuits

Cited by 22 publications

References 7 publications

Automated post bonding inspection by using machine vision techniques

Automated post bonding inspection by using machine vision techniques

Application of computer vision and laser interferometer to the inspection of line scale

A stereo vision system for the inspection of IC bonding wires

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