Due to their polymorphism, TiO2 films are quintessential components of state-of-the-art functional materials and devices for various applications from Dynamic Random Access Memory to Solar Water Splitting. However, contrary to other semiconductor/dielectric materials, the relationship between structural/morphological and electrical properties at the nano and micro scales remains unclear. In this context, the morphological characteristics of TiO2 films obtained by Metal-Organic Chemical Vapor Deposition (MOCVD) and Plasma Enhanced Chemical Vapor Deposition (PECVD), the latter including nitrogen doping, are investigated and they are linked to their in-plane and out-plane electrical properties. A transition from dense to tree-like columnar morphology is observed for the MOCVD films with increasing deposition temperature. It results in the decrease of grain size and the increase of porosity and disorder, and subsequently it leads to the decrease of lateral carrier mobility. The increase of nitrogen amount in the PECVD films enhances the disorder in their pillar-like columnar