A Versatile SoC/SiP Sensor Interface for Industrial Applications: Implementation Challenges

Ali, Mohamed; Hassan, Ahmad; Honarparvar, Mohammad; Nabavi, Morteza; Audet, Yves; Savaria, Yvon

doi:10.1109/access.2022.3152379

Cited by 13 publications

(8 citation statements)

References 90 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The embedded wafer-level ball grid array (eWLB) is derived from the FOWLP [ 24 ]. Infineon created the first version of the eWLB by laying the qualified wafer face down on the larger wafer.…”

Section: Advanced Packaging Technologies In Sipmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

View full text Add to dashboard Cite

The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

show abstract

Section: Advanced Packaging Technologies In Sipmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

View full text Add to dashboard Cite

show abstract

“…With the continuous development of integrated circuit technology, electronic products are increasingly developing in the directions of miniaturization, intelligence, high performance, and high reliability. In this process, SiP plays an important role and is widely used [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Design and Simulation of a System-in-Package Chip for Combined Navigation

Yang,

Shi,

Jin

2024

Micromachines

View full text Add to dashboard Cite

This paper proposes a system-in-package combination navigation chip. We used wire bonding, chip stacking, surface mount, and other processes to integrate satellite navigation chips, inertial navigation chips, microprocessor chips, and separation devices. Finally, we realized the hardware requirements for combined navigation in a 20 mm × 20 mm chip. Further, we performed a multi-physics simulation analysis of the package design. For antenna signals, the insertion loss was greater than −1 dB@1 GHz and the return loss was less than −10 dB@1 GHz. The amplitude of these noises of the signal between the MCU and the IMU was approximately 20%, and the maximum value of the coupling coefficient between signal lines on the top surface was 13.4174%. The ninth mode of the power plane yielded a maximum voltage of 55 mV, and all power delivery networks had a DC voltage drop of less than 2%. The highest temperature in the microsystem was approximately 42 °C. These results show that our design performed well in terms of signal, power, and thermal performance.

show abstract

“…DC-DC buck converters are widely utilized in aerospace and automotive applications to drive and control electro-hydraulic actuators, such as solenoid valves [1]- [3]. Power buses within such systems are subject to transient overvoltage surges, often triggered by adjustments to the power bus's load [4], [5].…”

Section: Introductionmentioning

confidence: 99%

Enhanced Dynamic Regulation in Buck Converters: Integrating Input-Voltage Feedforward With Voltage-Mode Feedback

Amer,

Abuelnasr,

Ali

et al. 2024

IEEE Access

Self Cite

View full text Add to dashboard Cite

DC-DC buck converters in automotive and aerospace applications are often required to handle large disturbances in their input supply and abrupt variations in their loads. This paper proposes a systematic method to combine input-voltage feedforward (IVFF) and voltage-mode feedback (VFB) controllers, aiming to enhance the closed-loop performance of these DC-DC converters. This method relies on the stability boundary locus approach to help select the proper control parameters that achieve strong dynamic stability across the full operating range regardless of practical implementation challenges. Also, an optimization approach is employed to minimize the passive components' area within the compensator, achieving a 79% reduction in integration size compared to conventional designs. The controller was fabricated in a 0.35-µm CMOS technology, occupying a core area of 0.438 mm 2 . The prototype chip was experimentally tested to regulate a buck converter that leverages an e-GaN half-bridge while operating at 1 MHz. Measurement results show a remarkable closedloop performance against line and load variations, reaching up to ±80 V/ms and ±535 mA per 150 µs, respectively. The output remains stable, showcasing very small (< 100 mV) to non-existent spikes and fast recovery periods. In addition, the system shows fast startup times (< 100 µs) with small overshoots (< 1%) observed at the output. The system power efficiency, tested across various loads, peaks at 95.14% while operating at 695 mA load current. It is shown that the combined-controller approach entirely eliminates transient voltage spikes, offering up to 100% improvement in dynamic performance over a standalone VFB controller.INDEX TERMS Buck converter, controller design, DC-DC converter, dynamic regulation, feedforward, GaN half-bridge, high-voltage circuits, stability boundary locus, voltage-mode feedback.

show abstract

A Versatile SoC/SiP Sensor Interface for Industrial Applications: Implementation Challenges

Cited by 13 publications

References 90 publications

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Design and Simulation of a System-in-Package Chip for Combined Navigation

Enhanced Dynamic Regulation in Buck Converters: Integrating Input-Voltage Feedforward With Voltage-Mode Feedback

Contact Info

Product

Resources

About