Design and Simulation of a System-in-Package Chip for Combined Navigation
Yang Yang,
Guangyi Shi,
Yufeng Jin
Abstract:This paper proposes a system-in-package combination navigation chip. We used wire bonding, chip stacking, surface mount, and other processes to integrate satellite navigation chips, inertial navigation chips, microprocessor chips, and separation devices. Finally, we realized the hardware requirements for combined navigation in a 20 mm × 20 mm chip. Further, we performed a multi-physics simulation analysis of the package design. For antenna signals, the insertion loss was greater than −1 dB@1 GHz and the return… Show more
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