A Versatile Sacrificial Layer for Transfer Printing of Wide Bandgap Materials for Implantable and Stretchable Bioelectronics

Abstract

Improving and optimizing the processes for transfer printing have the potential to further enhance capabilities in heterogeneous integration of various sensing materials on unconventional substrates for implantable and stretchable electronic devices in biosensing, diagnostics, and therapeutic applications. An advanced transfer printing method based on sacrificial layer engineering for silicon carbide materials in stretchable electronic devices is presented here. In contrast to the typical processes where defined anchor structures are required for the transfer step, the use of a sacrificial layer offers enhances versatility in releasing complex microstructures from rigid donor substrates to flexible receiver platforms. The sacrificial layer also minimizes twisting and wrinkling issues that may occur in free-standing microstructures, thereby facilitating printing onto flat polymer surfaces (e.g., polydimethylsiloxane). The experimental results demonstrate that transferred SiC microstructures exhibit good stretchability, stable electrical properties, excellent biocompatibility, as well as promising sensing-functions associated with a high level of structural perfection, without any cracks or tears. This transfer printing method can be applied to other classes of wide bandgap semiconductors, particularly group III-nitrides and diamond films epitaxially grown on Si substrates, thereby serving as the foundation for the development and possible commercialization of implantable and stretchable bioelectronic devices that exploit wide bandgap materials.

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

“…Flexible and wearable electronics are an inevitable trend in the development of real-time and dynamic monitoring for human health since the thin-film electronics can offer better performance than traditional bulk systems, being lightweight, low-cost, and visible [ 17 , 23 , 24 , 28 , 176 , 177 , 178 , 179 , 180 ]. Although significant progress in the fabrication of thin-film materials and optimization of structure design, the realization for high-performance thin-film electronics compatible with a wafer-level batch process is still limited [ 181 , 182 , 183 , 184 , 185 , 186 , 187 , 188 ]. Thus, the development of transfer printing technology in the wafer-level for thin-film micro/nanoelectronics is important for high-yield production.…”

Implanted Flexible Electronics: Set Device Lifetime with Smart Nanomaterials

“…The result indicates the SiC films can last over 100 years at human body temperature. Two-dimensional SiC membranes with complex architectures such as serpentines and spiral shapes have been successfully transfer-printed onto polyimide, indicating the promising possibility for long-lived barrier layers capable of bending and stretching [ 42 ].…”

“…Left: tri-layer of parylene-C/HfO 2 /SiO 2 [ 41 ]. Right: A stretchable SiC membrane [ 42 ]. ( C ) Faradaic interfaces for recording and stimulation.…”

Dielectric properties of polydimethylsiloxane composites filled with SrTiO3 nanoparticles

“…[ 4–6 ] PDMS composites are widely used in flexible bioelectronics, as sensors, coatings and batteries, and also for three‐dimensional (3D)‐printing. [ 7–9 ]…”