10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems 2015
DOI: 10.1109/nems.2015.7147492
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A versatile multi-user polyimide surface micromachinning process for MEMS applications

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Cited by 32 publications
(18 citation statements)
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“…Figure 1b shows a schematic of the microbeam design and dimensions; which are length (l) 500 µm, width (w) 20 µm, and gap (g) 3.3 µm. These dimensions are selected to minimize the squeeze film damping in accordance with the fabrication process rules [47]. Figure 1c shows an SEM image of the clamped-clamped resonator.…”
Section: Fabricationmentioning
confidence: 99%
“…Figure 1b shows a schematic of the microbeam design and dimensions; which are length (l) 500 µm, width (w) 20 µm, and gap (g) 3.3 µm. These dimensions are selected to minimize the squeeze film damping in accordance with the fabrication process rules [47]. Figure 1c shows an SEM image of the clamped-clamped resonator.…”
Section: Fabricationmentioning
confidence: 99%
“…The device is fabricated using a six layer polyimide multi-user fabrication process with polyimide as a structural layer [34]. Using polyimide as a structural layer allows for the pattering of the metal layer to form independent gate electrodes.…”
Section: Fabricationmentioning
confidence: 99%
“…Then, the polyimide layer was processed after the pyrolisys steps, due to the polyimide's decomposition temperature of 450 • [14]- [25]. This material was processed following the procedure described in [26], [27]. Other materials such as SU-8 could be potentially used to have desired results [28], [29].…”
Section: Description Of the Fabrication Processmentioning
confidence: 99%