A Through-Hole Lead Connection Method for Thin-Film Thermocouples on Turbine Blades

Deng, Jinjun; Hui, Liuan; Zhang, Jietong; Jin, Xinhang

doi:10.3390/s19051155

Cited by 12 publications

(7 citation statements)

References 8 publications

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“…The compensation wire in the embedded ceramic substrate and the mask plate were completely fixed on the particular chuck. A NiCr functional film with a thickness of 800 nm was deposited on the substrate using the JZFZJ-500S (Sky Technology Development Co., Ltd., Chinese Academy of Sciences) high vacuum multifunctional composite coating equipment [ 20 ] with DC pulse magnetron sputtering technology. After preparing the NiCr film, we removed the NiCr functional film mechanical mask, replacing the NiSi functional film mechanical mask and the target material, and deposited the NiSi functional film to a thickness of 800 nm.…”

Section: Sensor Preparationmentioning

confidence: 99%

Preparation and Application of Nanocomposite Thin-Film Temperature Sensor during the Milling Process

Cui

Wang²,

Cao³

et al. 2022

Materials

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During the titanium alloy milling process, high temperatures in the tool-chip contact area will affect the tool life and precision of titanium alloy machining. Therefore, it is essential to measure the temperature of the tool-chip contact area continuously. In this paper, a finite element simulation model of the milling process was established using ABAQUS2020 to obtain the highest temperature location in the tool-chip contact area when milling titanium alloy. The integration of the wire with the alumina ceramic substrate formed an integrated wire substrate. Furthermore, NiCr, NiSi, and SiO2 films were deposited on the substrate sequentially using the DC pulsed magnetron sputtering technique. Finally, its microscopic morphology and static and dynamic performance were tested. The results show that the developed thin-film thermocouple temperature sensor has a Seebeck coefficient of 40.72 μV/°C and a dynamic response time of 0.703 ms. The application of the sensor to our titanium alloy milling experiments showed that the sensor can monitor the transient temperature in the tool-chip contact area, and its temperature measurement performance showed no detrimental effect from wearing. The effect of each milling parameter on the milling temperature was analyzed using ANOVA, and a regression model with an R-sq of 96.76% was obtained for the milling temperature.

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Section: Sensor Preparationmentioning

confidence: 99%

Preparation and Application of Nanocomposite Thin-Film Temperature Sensor during the Milling Process

Cui

Wang²,

Cao³

et al. 2022

Materials

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“…Only experimental measurements with no application to the grind-hardening field have been reported in the literature. (18)(19)(20)(21)(22) In addition, no simulation-based predictions have been reported. (18)(19)(20)(21)(22)…”

Section: Microstructure Of Grind-hardened Surface Layermentioning

confidence: 99%

“…Thin-film thermocouples are directly prepared on the surface of the structure using thin-film deposition techniques and include an insulating layer and a device layer to achieve in situ measurements of the surface transient temperature. (22) Therefore, thin-film thermocouples are perfect for this test sensor.…”

Section: Introductionmentioning

confidence: 99%

Effects of Heat Generated during Grind Hardening on Hardness and Microstructure of Alloy Metal: Optimal Process to Improve Efficiency

Gao¹,

Liu²,

Huang³

et al. 2020

Sensors and Materials

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Grind hardening is an alternative process to the conventional quenching process. The heat generated during grinding transforms the surface layer of workpieces into the martensitic structure. In this study, we simulated the temperature distribution during grind hardening to investigate the effects of heat on the changes in hardness and microstructure with different regrinding values using AISI 5140 alloy metal. We also compared the experimental results of single-and double-pass grind hardening processes. The results showed that the regrinding value affected the lateral distribution of hardness on the surface of the metal during grind hardening. The process created a softening width between the first and second ground layers, where a decreased softening width indicated the improved efficiency of grind hardening. It was found that double-pass grind hardening yielded the desired grinding results that reduced the softening width. The results of this study obtained using the AISI 5140 alloy metal also suggest that double-pass grind hardening can be used in high-efficiency quenching for various alloy metals.

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“…NiCr is used in the most common type of thermocouple, the type K thermocouple. [1] ITO is a promising candidate for a high-temperature TFTC to monitor the temperature in gas turbines [31,32] or for applications where optical transparency is required. [33] The thicknesses of ITO and NiCr were varied between nominal values of 10 and 430 nm and confirmed with a stylus profilometer.…”

Section: Introductionmentioning

confidence: 99%

Effect of Thickness Variation on the Measured Seebeck Coefficient and Power Factor in ITO–NiCr Thin‐Film Thermocouples

Jiang

Xie

Heiss

et al. 2023

Physica Status Solidi (a)

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Herein, the electrical resistivity, Seebeck coefficient, and power factor of an indium tin oxide (ITO) and nickel‐chromium (NiCr) thermocouple are investigated. The thicknesses of the ITO and NiCr are varied between 10 and 430 nm. Seebeck coefficients between 12.8 and (21.4 ± 1.5) μV K−1 are measured, respectively. The results indicate that a reduction in thickness generally leads to an increase in the Seebeck coefficient until a maximum value is reached. Among the measured samples, the optimal Seebeck coefficients are found with an ITO thickness of (111 ± 4) nm and NiCr thickness of (18 ± 2) nm. Finally, the power factor of the thermocouples is determined, with a maximum power factor of (84 ± 7) μW m−1 K−2 for the ITO thickness of (111 ± 4) nm and nickel‐chromium thickness of (42 ± 5) nm.

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A Through-Hole Lead Connection Method for Thin-Film Thermocouples on Turbine Blades

Cited by 12 publications

References 8 publications

Preparation and Application of Nanocomposite Thin-Film Temperature Sensor during the Milling Process

Preparation and Application of Nanocomposite Thin-Film Temperature Sensor during the Milling Process

Effects of Heat Generated during Grind Hardening on Hardness and Microstructure of Alloy Metal: Optimal Process to Improve Efficiency

Effect of Thickness Variation on the Measured Seebeck Coefficient and Power Factor in ITO–NiCr Thin‐Film Thermocouples

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