Abstract:A 100Å-thick SiGe (22.5%) channel MOSFET with gate length down to 40nm has been successfully integrated with 14Å nitrided gate oxide as well as a 1200Å high-compressive PECVD ILD-SiN x stressing layer as the contact etching stop layer (CESL) that enhances the PMOS electron mobility with +33% current gain. To achieve a poly-Si gate length target of 400Å (40nm), a 193nm scanner lithography and an aggressive oxide hard mask etching techniques were used. First, a 500Å-thick TEOS hard mask layer was deposited upon … Show more
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