2011
DOI: 10.1115/1.4003516
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A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator

Abstract: The DJOSER analytical thermal solver for multilayer mounting structures has been tested as a useful and friendly tool for the thermal analysis of power electronic devices and their packages, able to replace the onerous programs based on the finite element method (FEM) calculations. The other problem connected with the packaging evaluation is the calculation of the thermally induced stresses and strains in the various layers composing the assembling structures. This paper deals with the first step of the implem… Show more

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Cited by 4 publications
(2 citation statements)
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“…Consequently, it is possible to calculate beforehand the possible damage in electronic devices due to cyclic thermal and thermomechanical loads [9,10]. Bagnoli et al [11] proposed an analytical solution to substitute expensive FEM software, but the strategy is applicable only for steady-state processes in notional structures of two layers. Yang and Chen [12] conducted an experimental investigation to test dynamic behavior of electronic packaging, but only considering a fixed and reliable design.…”
Section: Systemmentioning
confidence: 99%
See 1 more Smart Citation
“…Consequently, it is possible to calculate beforehand the possible damage in electronic devices due to cyclic thermal and thermomechanical loads [9,10]. Bagnoli et al [11] proposed an analytical solution to substitute expensive FEM software, but the strategy is applicable only for steady-state processes in notional structures of two layers. Yang and Chen [12] conducted an experimental investigation to test dynamic behavior of electronic packaging, but only considering a fixed and reliable design.…”
Section: Systemmentioning
confidence: 99%
“…Bagnoli et al . proposed an analytical solution to substitute expensive FEM software, but the strategy is applicable only for steady‐state processes in notional structures of two layers. Yang and Chen conducted an experimental investigation to test dynamic behavior of electronic packaging, but only considering a fixed and reliable design.…”
Section: Introductionmentioning
confidence: 99%