A Suggested Vacuum Bagging Process for the Fabrication of Single-Walled Carbon Nanotube/Epoxy Composites That Maximize Electromagnetic Interference Shielding Effectiveness

Abstract

We designed and tested a manufacturing process that resulted in the formation of composites with maximized electrical conductivity and optimized electromagnetic interference (EMI) shielding effectiveness (SE) properties. Single-walled carbon nanotube (SWCNT) paper, which is a microscopic aggregate of van der Waals force interaction, was impregnated with semi-cured epoxy to make SWCNT prepregs. These prepregs were completely cured into SWCNT/epoxy composites. Fabricating and curing processes were executed under proper temperature cycle depending on the time. We inspected SWCNT paper and the interfacial state between the SWCNTs and epoxy in the composite with a field emission-scanning electron microscopy and calculated the SWCNT weight fraction through thermogravimetric analysis measurements. Using these observations, electrical conductivity and EMI SE were investigated according to thickness which could be controlled by the suggested manufacturing process as 1-, 5- and 10-layer composites. Finally, we determined ideal composite thickness and the associated number of prepreg layers using skin depth theory.

Enhanced Electromagnetic Interference Shielding Properties of Immiscible Polyblends with Selective Localization of Reduced Graphene Oxide Networks

“…With the rapid development of communications and internet technologies, electromagnetic interference (EMI) has emerged as a serious threat to the stable functioning of electronic devices [ 5 , 6 , 7 , 8 ]. The application of CPCs with nanofillers is one of the solutions.…”

Environmental Resistance and Fatigue Behaviors of Epoxy/Nano-Boron Nitride Thermally Conductive Structural Film Adhesive Toughened by Polyphenoxy

“…Ke et al [22] prepared a novel film adhesive for the bonding of carbon fiber reinforced polymer (CFRP) composites to steel substrates, and the results showed that there was a stronger interfacial bond in the adhesive layer and better adherence than in the intralaminar of CFRPs. The development of technology put forward functional requirements for adhesive materials, such as adhesives with thermal conductivity [23][24][25][26], wave absorption [27], and electromagnetic shielding properties [28,29]. Researchers developed a series of functional adhesives to meet the needs of different fields [30].…”