1984
DOI: 10.1109/t-ed.1984.21491
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A subnanosecond 2000 gate array with ECL 100K compatibility

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1984
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Cited by 6 publications
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“…2 Methods for the electrochemical processing of copper are crucial to the advancement of the microelectronics/semiconductor industry. For example, these methods include electroplating 3 and those processes that involve the anodic dissolution of copper such as electrochemical machining (ECM), electrochemical-mechanical polishing 4,5 and classical electropolishing. [6][7][8][9] The preponderance of the methods used for the electrochemical processing of copper are based on aqueous chloride-containing solutions.…”
mentioning
confidence: 99%
“…2 Methods for the electrochemical processing of copper are crucial to the advancement of the microelectronics/semiconductor industry. For example, these methods include electroplating 3 and those processes that involve the anodic dissolution of copper such as electrochemical machining (ECM), electrochemical-mechanical polishing 4,5 and classical electropolishing. [6][7][8][9] The preponderance of the methods used for the electrochemical processing of copper are based on aqueous chloride-containing solutions.…”
mentioning
confidence: 99%