A Study on Thermal Contact Resistance at the Interface of Two Solids

Zhang, X.; Cong, Peizhong; Fujii, Minoru

doi:10.1007/s10765-006-0064-z

Cited by 50 publications

(18 citation statements)

References 10 publications

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“…In order to obtain an accurate thermal contact resistance, the temperature drop across the interface should be maintained relative large (e.g. > 2 °C [27]) through the control of applied heating power. In addition to bare contacts, thermal interface materials (TIMs) are usually employed to reduce thermal contact resistance.…”

Section: Absolute Techniquementioning

confidence: 99%

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Zhao

Qian

et al. 2016

Journal of Electronic Packaging

385

222

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Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state method, transient hot-wire method, laser flash diffusivity method, and transient plane source method are most used.For thin film measurement, the 3ω method and the transient thermoreflectance technique including both time-domain and frequency-domain analysis are widely employed. This work reviews several most commonly used measurement techniques. In general, it is a very challenging task to determine thermal conductivity and interfacial thermal conductance with less than 5% error.Selecting a specific measurement technique to characterize thermal properties needs to be based on: 1) knowledge on the sample whose thermophysical properties is to be determined, including the sample geometry and size, and the material preparation method; 2) understanding of fundamentals and procedures of the testing technique, for example, some techniques are limited to samples with specific geometries and some are limited to a specific range of thermophysical properties; 3) understanding of the potential error sources which might affect the final results, for example, the convection and radiation heat losses.

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Section: Absolute Techniquementioning

confidence: 99%

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Zhao

Qian

et al. 2016

Journal of Electronic Packaging

385

222

View full text Add to dashboard Cite

show abstract

“…The thermal contact resistance at the interface of two solids in contact is very imperative in many fields including bearing lubrication, heat transfer across granular solids, aerospace structure [19,20], etc. All surfaces are rough to a degree and only a few portion of surfaces in fact come into contact; therefore, heat flow from one object to another is regarded by this incomplete contact, which results to thermal contact resistance [21].…”

Section: Thermal Contact Resistancementioning

confidence: 99%

Thermal characteristic analysis of high-speed motorized spindle system based on thermal contact resistance and thermal-conduction resistance

Liu

Mao

Zhang

et al. 2014

Int J Adv Manuf Technol

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In view of thermal resistance problem of the motorized spindle system, this paper proposes a thermal resistance network model of spindle-bearing-bearing pedestal based on the fractal and Hertz contact theory. According to this model and Kirchhoff's law, the heat balance equations for thermal nodes are established and solved with Gauss-Seidel iterative method to gain temperature values of the main thermal nodes. In order to accurately understand thermal characteristics of the motorized spindle system, the effect of thermal contact resistance and thermal-conduction resistance is taken into consideration. Thermal simulation analysis is carried out on the motorized spindle system. On a precision horizontal machining center, the temperature rise of motorized spindle parts is implemented under different rotational speeds with LMS data acquisition system. It is shown that temperature values based on thermal resistance network model agree well with those of simulation analysis and experimental results. What is more, the whole thermal deformations of the main components of the motorized spindle system are analyzed.

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“…Secondly a 3D conduction simulation of the process is performed with COMSOL multiphysics to compute temperature and heat flux fields over the whole sample. The main studied parameter is the thermal contact resistance (R ctc ) appearing between the sample and the HFM [7]. Two important points are particularly detailed: the time for samples to be at thermal steady state and the heat flux values.…”

Section: Calibration With Thin Samplesmentioning

confidence: 99%

“…The former is frosted in order to remove the major part of the oxide layer whereas silicon has no particular treatment. The thermo-physical properties used in our calculations are summarized in Thermal properties of samples are extracted from values provided in literature [7]. Taking into account their temperature dependence, these values were extrapolated for room temperature of sample surfaces.…”

Section: Calibration With Thin Samplesmentioning

confidence: 99%