2000
DOI: 10.1109/6040.846648
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A study of the high frequency performance of thin film capacitors for electronic packaging

Abstract: The provision of adequate decoupling capacitance in the power distribution system for integrated circuits (IC's) is an increasing concern. As clock rates and the IC gate density increase, discrete chip capacitors do not satisfy the decoupling requirements for high current switching at very high frequencies.Thin film capacitors not only exhibit better high frequency performance than discrete ceramic capacitors, but also provide the possibility for passive component integration. In this work, the high frequency … Show more

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Cited by 17 publications
(3 citation statements)
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“…The dielectric properties of insulating materials are important in many applications. The examples include low-k interconnect dielectric materials for microelectronics applications [1], films for random access memories [2], decoupling capacitors [3] and high-k dielectrics for transistor applications [4], among others. Methods of depositing various types of materials for producing thin films and nanostructures to be used as electrical or thermal insulators continue to be of current research interest [5].…”
Section: Introductionmentioning
confidence: 99%
“…The dielectric properties of insulating materials are important in many applications. The examples include low-k interconnect dielectric materials for microelectronics applications [1], films for random access memories [2], decoupling capacitors [3] and high-k dielectrics for transistor applications [4], among others. Methods of depositing various types of materials for producing thin films and nanostructures to be used as electrical or thermal insulators continue to be of current research interest [5].…”
Section: Introductionmentioning
confidence: 99%
“…A typical anodized layer thickness of 0.15 m along with a relative dielectric constant of r ϭ 8.8 for anodized aluminum results in capacitive densities in the range of 460 -600 pF/mm 2 [5,6]-much larger than is possible with the standard dielectrics used to form interconnect-layer capacitors. The very thin dielectric also reduces the inductance of the anodized layer to just a few pH [7,8], an amount much smaller than the inductance of the interconnect necessary to connect to the capacitor. As a result, interconnect parasitics limit the performance of MCM-D embedded capacitors in a manner similar to the way lead parasitics limit the performance of chip components.…”
Section: Introductionmentioning
confidence: 99%
“…Parasitic resistance and capacitance between devices on a high-density integrated circuit platform is also an issue even if the transistor size is above the minimum practical size limit 6,7,8 . As the distance between on-chip electronic devices decreases, the higher contact resistance and contact-to-gate capacitance is on the order of the on-chip channel and intrinsic resistance and capacitance 9 .…”
Section: I1 Fundamental Limits To Integrated Circuit Growthmentioning
confidence: 99%