A Study of Connectors and Feed Lines De-Embedding Techniques for PCB Microwave Components S-Parameters Measurements Up To 50 Ghz

Salnikov, A. S.; Добуш, И. М.; Bilevich, Dmitry V.; Popov, A.; Kalentyev, A. A.; Goryainov, A. E.

doi:10.1109/dynamics50954.2020.9306169

Cited by 4 publications

(6 citation statements)

References 14 publications

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“…𝑅 + 𝑗𝜔𝐿 = 𝑅 0 (1 + 𝑗)√𝜔/𝜔 0 + 𝑗𝜔𝐿 ext (12) which is obtained from the common model [44] by neglecting the RDC term. This corresponds to the case with infinitely-thick conductor, and is reasonably accurate at high frequencies when skin depth is smaller than the cross-sectional dimension.…”

Section: A Theoretical Analysis Of Ztdr(t)mentioning

confidence: 99%

“…With the model (12) (25) where 𝑍 ∞ = √𝐿 ext /𝐶. Next, using binomial expansion for (25) and keeping only the first two terms (high frequency approximation), we get 𝑍 LINE (𝑠) ≈ 𝑍 ∞ (…”

Section: Derivation Of (13)mentioning

confidence: 99%

“…Recently, the 2x-thru calibration [5][6][7][8][9][10][11][12][13][14][15] has emerged as an attractive alternative to the TRL due to its simplicity. The basic version of 2x-thru assumes symmetric fixtures, but requires the measurement of FDUT and THRU only.…”

Section: Introductionmentioning

confidence: 99%

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The Reference Impedance in 2x-thru Calibration, and its Estimation for High Conductor-loss Transmission Lines

Chou¹

2022

Preprint

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<p>The 2x-thru calibration has emerged as an attractive alternative to the classical TRL for S parameter measurement of printed circuit board and packaging devices, due to its simplicity that only one THRU standard suffices to fully characterize the test fixtures, thus eliminating the LINE measurement in TRL and also overcoming the bandwidth limit. Although various 2x-thru calibration tools are available nowadays, there are still some issues that have not been studied in detail. This paper addresses the following two fundamental questions: (i) what is the reference impedance (Zref) of the S parameters after 2x-thru calibration? (ii) what is the time-domain reflectometry (TDR) response of the THRU for high conductor-loss transmission lines, and how to estimate Zref given such TDR? For problem (i), we rigorously show that the Zref is equal to the characteristic impedance of the center transmission line in the THRU standard, and provide the important interpretation for the S parameters in terms of the traveling-wave and pseudowave concepts. For problem (ii), we show that the TDR impedance is a monotonically increasing function instead of constant, and we propose a new method to estimate the characteristic impedance by fitting the TDR with a causal impedance model. Simulation and measurement examples are provided to validate the proposed theory and techniques. In the last example, we also compare five commercial/open-source 2x-thru calibration tools; the results reveal that with the proposed method of impedance estimation, better accuracy can be achieved. </p>

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Section: A Theoretical Analysis Of Ztdr(t)mentioning

confidence: 99%

Section: Derivation Of (13)mentioning

confidence: 99%

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The Reference Impedance in 2x-thru Calibration, and its Estimation for High Conductor-loss Transmission Lines

Chou¹

2022

Preprint

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“…Then, some potential sources of error are hypothesized and overcome by proposing solutions based on a de-embedding plane that can ensure a TEM (or quasi-TEM) mode propagation. 6,7 In particular, in reference 8, the electrical performance of the test patterns used in the deembedding method for DUT characterization was studied thoroughly and for all test patterns, and full wave models were built and then analyzed based on simulated electrical performances. About analytical methods, Chen 9 has shown that the de-embedding procedures are sensitive to manufacturing variations in the test fixtures, as well as inaccuracies associated with the calibration and measurement process.…”

Section: Introductionmentioning

confidence: 99%

Generalized analytical formulation for de‐embedding of multiport devices based on known fixtures

Scafati

Paulis

Olivieri

et al. 2022

Int J RF Mic Comp-Aid Eng

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The de-embedding is a technique used in radio frequency and signal integrity measurements to extract the scattering (S)-parameters of the device under test (DUT) from the measured data of a global assembly and based on known S-parameters of the left and right test fixtures; thus, it removes the impact of the text fixtures used for the connection of the DUT to the instrumentation. Once the S-parameters are measured, the de-embedding is performed by a multistep approach involving the bidirectional transformation of the S-parameters into the corresponding transfer scattering (T)-parameters. The latter approach is well established for two-and four-port networks and has been recently expanded to the multiport case. This work proposes an alternative analytical formulation to de-embed a multiport device, knowing in advance only the S-parameters of the global multiport assembly and those of the test fixtures. The proposed method does not involve the S-to-T conversion and it requires only the algebraic manipulation of the S-parameter matrix elements; its practical implementation is very well fitted especially for multiport cases, and it is very fast in calculating the de-embedded DUT S-parameters for large port numbers. The results of the proposed formulation, applied to the case of a multipin high-speed connector, are compared with those obtained by measurement and simulations.Their accuracy is shown and discussed to demonstrate the validity of the proposed approach.

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“…In this case the de-embedding of the test fixtures (usually named "left" and "right" fixtures) need to be applied in order to extract the impact of their presence from the overall measured S-parameter. This is done knowing the S-parameter data of the single fixtures that are applied before and after the DUT [5][6][7][8][9]. Usually the well-known de-embedding process in frequency domain is based at least on three main conceptual steps: first, the conversion of the S-parameters in the transfer scattering parameters (Tparameters) [10], second the algebraic manipulation and inversion of the T-parameter matrices, and third the final T-to-S parameter transformation.…”

Section: Introductionmentioning

confidence: 99%

Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly

et al. 2021

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The de-embedding of measurement fixtures is relevant for an accurate experimental characterization of radio frequency and digital electronic devices. The standard technique consists in removing the effects of the measurement fixtures by the calculation of the transfer scattering parameters (T-parameters) from the available measured (or simulated) global scattering parameters (S-parameters). The standard de-embedding is achieved by a multiple steps process, involving the S-to-T and subsequent T-to-S parameter conversion. In a typical measurement setup, two fixtures are usually placed before and after the device under test (DUT) allowing the connection of the device to the calibrated vector network analyzer coaxial ports. An alternative method is proposed in this paper: it is based on the newly developed multi-network cascading algorithm. The matrices involved in the fixture-DUT-fixture cascading gives rise to a non-linear set of equations that is in one step analytically solved in closed form, obtaining a unique solution. The method is shown to be effective and at least as accurate as the standard multi-step de-embedding one.

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A Study of Connectors and Feed Lines De-Embedding Techniques for PCB Microwave Components S-Parameters Measurements Up To 50 Ghz

Cited by 4 publications

References 14 publications

The Reference Impedance in 2x-thru Calibration, and its Estimation for High Conductor-loss Transmission Lines

The Reference Impedance in 2x-thru Calibration, and its Estimation for High Conductor-loss Transmission Lines

Generalized analytical formulation for de‐embedding of multiport devices based on known fixtures

Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly

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