A study of carrier motion on a dual-face CMP machine

Tso, Pei-Lum; Wang, Yuyuan; Tsai, Ming-Jiang

doi:10.1016/s0924-0136(01)01045-7

Cited by 22 publications

(15 citation statements)

References 1 publication

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“…Further, a quantitative analysis [ 19 ] has been also conducted to assess the uniformity of trajectories by multiple abrasive particles on workpiece by the assistance of Matlab according to the following steps:…”

Section: Evaluation Of Surface Quality With the Novel Driving Systmentioning

confidence: 99%

Surface Quality Improvement by Using a Novel Driving System Design in Single-Side Planetary Abrasive Lapping

Chen

Wen

Lu³

et al. 2021

Materials

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For the traditional single-side planetary abrasive lapping process particle trajectories passing over the target surface are found to be periodically superposed due to the rational rotation speed ratio of the lapping plate to workpiece that could affect the material removal uniformity and hence its surface quality. This paper reports on a novel driving system design with combination of the tapered roller and contact roller to realize the irrational rotation speed ratio of the lapping plate to workpiece in the single-side planetary abrasive lapping process for the improvement of surface quality. Both of the numerical and experimental investigations have been conducted to evaluate the abrasive lapping performance of the novel driving system. It has been found from the numerical simulation that particle trajectories would theoretically cover the whole target surface if the lapping time is long enough due to their non-periodic characteristics, which can guarantee the uniformity of material removal from the surface of workpiece with relatively high surface quality. The encouraging experimental results underline the potential of the novel driving system design in the application of the single-side planetary abrasive lapping for the improvement of the surface quality in terms of surface roughness and material removal uniformity.

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Section: Evaluation Of Surface Quality With the Novel Driving Systmentioning

confidence: 99%

Surface Quality Improvement by Using a Novel Driving System Design in Single-Side Planetary Abrasive Lapping

Chen

Wen

Lu³

et al. 2021

Materials

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“…The percentage ratio of the standard deviation of thickness relative to the averaged value was used to calculate the WIWNU [12][13][14]. A surface profile topography system (KLA-Tencor HRP-350) was used to measure the surface roughness and the Cu dishing on Si wafers.…”

Section: Cmp Experiments and Characterizationsmentioning

confidence: 99%

Y2O3 nanosheets as slurry abrasives for chemical-mechanical planarization of copper

Chen

Zhao

et al. 2013

Friction

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Continued reduction in feature dimension in integrated circuits demands high degree of flatness after chemical mechanical polishing. Here we report using new yttrium oxide (Y 2 O 3 ) nanosheets as slurry abrasives for chemical-mechanical planarization (CMP) of copper. Results showed that the global planarization was improved by 30% using a slurry containing Y 2 O 3 nanosheets in comparison with a standard industrial slurry. During CMP, the two-dimensional square shaped Y 2 O 3 nanosheet is believed to induce the low friction, the better rheological performance, and the laminar flow leading to the decrease in the within-wafer-non-uniformity, surface roughness, as well as dishing. The application of the two-dimensional nanosheets as abrasive in CMP would increase the manufacturing yield of integrated circuits.

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“…During machining, the effects of different polishing parameters for polishing are apparent.The performance test of polishing machine mainly checks polishing quality in all kinds of pressure. According to the previous study, polishing quality depends on surface quality of sample [5] .…”

Section: Liquid-provide-system Design With Variable Pressure Regulmentioning

confidence: 99%

Research on control system of new type ceramic polishing machine

Wei

Yan

et al. 2011

2011 Second International Conference on Mechanic Automation and Control Engineering

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Based on the shortcomings of the conventional polishing machine, a new type of control system on ceramic polishing machine was designed: and then using the counters and tachometers, grinding time can be automatically controlled; control system composed of loading sensor is good to precisely control the loading force during polishing; It effectively overcame the wear on valves and feed liquid pumps by using regulating system with automatic mixing function, reducing the incidence of clogging.The results indicate that ceramic polishing machine can process high-precision ceramic products at the low cost to satisfy the needs of production and scientific research greatly. Keywords-ceramic material; polishing machine; control system I. PREFACENew ceramic materials have become one foundation of the development on many aspects such as high precision machinery, air space and military, optical information. Based on performance and application range new ceramics are divided into functional ceramics and engineering ceramics. Engineering ceramics mainly refer to physical, chemical or biological effects of ceramic materials directly or coupled to achieve particular features of pottery, which has a wide range of applications in electronic, communications, computers, lasers, aerospace sector, and so on.Structure ceramic materials possess high temperature resistance besides antifraying. New materials hold a wide application prospect as mechanical parts with high-performance. However, due to lack of process stability, it is likely to scratch the surface of the workpiece, even damage the workpiece when polishing ceramic materials. Therefore, we need a polishing machine with loading stably to improve the polishing technology, further enhancing the machining quality.In domestic, the traditional double-sided polishing machines generally use a single motor to move the upper and lower polishing disks, the center wheel and ring gear move through the gear driving. This kind of polishing machine holds low gravity, stable performance, and simple operation. Because of using planetary motion ball-milling is efficient and of fine granularity. Therefore it is usually used in precision grinding and polishing. However, there are some shortcomings in the mechanical structure of this grinding and polishing machine. For example, its control system is imperfect so that we can control it only by manually or semi-automatically. Because of the single-mast structure its relative rigidity is poorer. And machining precision can not reach the processing requirement of wafer. It reduces the processing stability in the grinding process. When processing the hard and brittle materials such as ceramic, it is possible to scratch the surface of the workpiece, and even damage the workpiece [1] .Based on the performance of ceramic materials, we would study the control system of ceramic polishing machine in this paper, and then design a new type of ceramic polishing machine, so as to meet the accuracy requirement of ultraprecision machining on the difficult-to-machine...

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A study of carrier motion on a dual-face CMP machine

Cited by 22 publications

References 1 publication

Surface Quality Improvement by Using a Novel Driving System Design in Single-Side Planetary Abrasive Lapping

Surface Quality Improvement by Using a Novel Driving System Design in Single-Side Planetary Abrasive Lapping

Y2O3 nanosheets as slurry abrasives for chemical-mechanical planarization of copper

Research on control system of new type ceramic polishing machine

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