A study of adaptive mesh refinement techniques for an efficient capture of the thermo-mechanical phenomena in power integrated circuits

Bojita, Adrian; Purcar, Marius; Boianceanu, C.; Tomas, Edgar; Ţopa, Vasile

doi:10.1109/smicnd.2017.8101201

Cited by 4 publications

(2 citation statements)

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“…Meshing studies [9], [44], and [45] demonstrated that elastic and plastic behavior regions require specific mesh elements and densities in order to accurately capture the undergoing processes. An unstructured mesh of linear tetrahedral elements was generated for the domains of elastic material properties (Si or SiO2).…”

Section: Meshmentioning

confidence: 99%

“…For the domains with nonlinear material properties (i.e., Al or Cu), characterized by nonlinear kinematic hardening Chaboche model, to avoid any blockage (e.g., generated by the linear tetrahedral mesh elements [44]), a structured mesh of lower-order hexahedral elements was generated. In addition, a high-density mesh is required for the interest region to accurately capture the thermally induced deformations [45]. For example, an adaptive structured hexahedral mesh, varying in size from 0.25 to 0.05 µm, in metallic regions with nonlinear material properties, was generated.…”

Section: Meshmentioning

confidence: 99%

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A Novel Multi-Scale Method for Thermo-Mechanical Simulation of Power Integrated Circuits

Bojita

Purcar

Simon

et al. 2022

IEEE J. Electron Devices Soc.

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During development of power IntegratedCircuits (IC), several iterations between the design and test/ measurement steps are performed. Computer-aided engineering significantly shortens the product development process because the numerical simulations can identify and remediate most deficiencies during the design stage. The recent IC manufacturing technologies lead to ca. 10 4 -order scale separation between transistor cell details and the device active area, resulting in very complex IC models. For the IC complexity to be overcome, advanced multi-scale analysis methods are required to perform accurate simulations in a decent time (order of hours). This paper proposes an advanced and enhanced multi-scale simulation method for the thermo-mechanical analysis of power ICs. The computational IC structure is automatically generated from a Cadence layout and partitioned into far-field and homogenized regions -the macro-model. Detailed localized micro-scale sub-models are assigned to limited portions of the homogenized region. The two-way simulated data transfer between the homogenized macro-model and the micro sub-models is one multi-scale approach novelty proposed in this paper. The method is validated on a real test chip structure presented in literature. The proposed multi-scale approach in conjunction with the two-way macro-micro data transfer lead to similar accuracy in the prediction of defect location, yet with significant simulation time -and computational resource reduction (CPU time and RAM usage reduced by almost 80% and 60% respectively) compared to the method used as reference.

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Section: Meshmentioning

confidence: 99%

Section: Meshmentioning

confidence: 99%