A steady-state thermoreflectance method to measure thermal conductivity

Braun, Jeffrey L.; Olson, David H.; Gaskins, John T.; Hopkins, Patrick E.

doi:10.1063/1.5056182

Cited by 82 publications

(49 citation statements)

References 27 publications

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“…Computational simulations can be performed using molecular dynamics (MD) simulations [39][40][41][42], density functional theory [43,44], and Monte Carlo ray tracing simulations [45,46]. Finally, nanoscale experimental techniques include electrothermal characterization (3-x [47], transient electrothermal [48,49], and scanning-probe based [50][51][52] systems) and optical pump-probe thermoreflectance characterization (time-domain thermoreflectance (TDTR) [53][54][55][56], frequency-domain thermoreflectance [57][58][59], and steady-state thermoreflectance [60]).…”

Section: Thermal Transport Within Nanostructured Materialsmentioning

confidence: 99%

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Warzoha

Wilson

Donovan

et al. 2021

Journal of Electronic Packaging

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This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hierarchies that make up modern electronic devices. This includes those mechanisms that impact thermal transport through: (1) substrates, (2) interfaces and 2-D materials and (3) heat spreading materials. For each material layer, we provide examples of recent works that (1) demonstrate improvements in thermal performance and/or (2) improve our understanding of the relevance of nanoscale thermal transport across material junctions. We end our discussion by highlighting several additional applications that have benefited from a consideration of nanoscale thermal transport phenomena, including RF electronics and neuromorphic computing.

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Section: Thermal Transport Within Nanostructured Materialsmentioning

confidence: 99%

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Warzoha

Wilson

Donovan

et al. 2021

Journal of Electronic Packaging

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“…Thus, in our experiment the steady-state temperature rise is negligible. According to Braun et al [24] this means the "off" state of the steady-state temperature rise. Following expression was used to calculate : [6] = 4 n 2 (8) where ≈ 1.5 µm.…”

Section: Resultsmentioning

confidence: 99%

Laser Pump‐Probe Fiber‐Optic Technique for Characterization of Near‐Surface Layers of Solids: Development and Application Prospects for Studying Semiconductors and Weyl Semimetals

Старостин

Lonchakov

et al. 2020

Annalen der Physik

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A fiber-optic setup incorporating the pump-probe thermoreflectance (TR) technique with Fabry-Perot (FP) interferometer is presented. It includes both heat pump and probe lasers, producing wavelengths of 1470 and 1530 nm, respectively, together with a reflected radiation detector. Heat pump pulse duration varies from a few microseconds to tens of microseconds. The potential of the pump-probe TR-FP technique to investigate the subsurface region of semiconductors with a range of electron spectra is demonstrated. A pronounced dip in time dependence of the TR-FP signal is discovered at the liquid nitrogen temperature in the gapless semiconductor compound HgSe-a candidate for the family of Weyl semimetals with broken inversion symmetry. This finding implies the developed pulsed TR-FP method for the detection of Weyl nodes and surface Fermi arcs in solids.

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“…Thermal conductivity measurements were performed using the optical pump-probe technique steady-state thermoreflectance, described in detail below in Section 3.8 [37].…”

Section: Methodsmentioning

confidence: 99%

“…The thermal conductivity of four chitosan-bismuth TE composite films with weight ratio of 1:2000 binder to 100-mesh Bi particles at 300 MPa were measured by non-contact, optical pump-probe technique steady-state thermoreflectance (SSTR) [37]. SSTR uses Fourier's law to determine the thermal conductivity of a material by varying the incident pump power (proportional to heat flux) on the sample surface and detecting the reflectance change (proportional to temperature rise) [40,41] by a probe laser.…”

Section: Thermal Conductivitymentioning

confidence: 99%

“…Before the SSTR measurements, a thin Al layer was deposited on top of the sample surface by electron beam evaporation to convert the optical energy into thermal energy. The SSTR measurements were conducted using a sapphire wafer as a calibration to determine the experimental proportionality constant according to the procedure that was described in Braun et al (2019). For each sample, the measurements were repeated with two different objectives (5× and 10×).…”

Section: Thermal Conductivitymentioning

confidence: 99%

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Thermoelectric Performance Enhancement of Naturally Occurring Bi and Chitosan Composite Films Using Energy Efficient Method

et al. 2020

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This work presents an energy efficient technique for fabricating flexible thermoelectric generators while using printable ink. We have fabricated thermoelectric composite thick films using two different mesh sizes of n-type bismuth particles, various binder to thermoelectric material weight ratios, and two different pressures, 200 MPa and 300 MPa, in order to optimize the thermoelectric properties of the composite films. The use of chitosan dissolved in dimethylsulfoxide with less than 0.2 wt. % of chitosan, the first time chitosan has been used in this process, was sufficient for fabricating TE inks and composite films. Low temperature curing processes, along with uniaxial pressure, were used to evaporate the solvent from the drop-casted inks. This combination reduced the temperature needed compared to traditional curing processes while simultaneously increasing the packing density of the film by removing the pores and voids in the chitosan-bismuth composite film. Microstructural analysis of the composite films reveals low amounts of voids and pores when pressed at sufficiently high pressures. The highest performing composite film was obtained with the weight ratio of 1:2000 binder to bismuth, 100-mesh particle size, and 300 MPa of pressure. The best performing bismuth chitosan composite film that was pressed at 300 MPa had a power factor of 4009 ± 391 μW/m K2 with high electrical conductivity of 7337 ± 522 S/cm. The measured thermal conductivity of this same sample was 4.4 ± 0.8 W/m K and the corresponding figure of merit was 0.27 at room temperature.

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A steady-state thermoreflectance method to measure thermal conductivity

Cited by 82 publications

References 27 publications

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Laser Pump‐Probe Fiber‐Optic Technique for Characterization of Near‐Surface Layers of Solids: Development and Application Prospects for Studying Semiconductors and Weyl Semimetals

Thermoelectric Performance Enhancement of Naturally Occurring Bi and Chitosan Composite Films Using Energy Efficient Method

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