Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Warzoha, Ronald J.; Wilson, Adam A.; Donovan, Brian F.; Dönmezer, Nazlı; Giri, Ashutosh; Hopkins, Patrick E.; Choi, Sukwon; Pahinkar, Darshan G.; Shi, Jingjing; Graham, Samuel; Tian, Zhiting; Ruppalt, Laura B.

doi:10.1115/1.4049293

Cited by 45 publications

(21 citation statements)

References 405 publications

(555 reference statements)

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“…This heat dissipation phenomenon was also reported by Minnich's research groups by phonon BTE and time-domain thermoreflectance experiments [35,36]. Those results suggest that heat dissipations or cooling in nanoscale hotspot systems including integrated circuits [5,3] might not be as challenging as previously expected.…”

Section: Introductionsupporting

confidence: 84%

“…The heat dissipation problem at micro/nano scale has become one of the key bottlenecks restricting the further development of the microelectronics industry. Hence, it is much important to understand the thermal transport mechanisms in microelectronic devices [5,3] to realize optimal and effective waste heat removal and improve device performance and reliability.…”

Section: Introductionmentioning

confidence: 99%

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Non-monotonic heat dissipation phenomenon in close-packed 2D and 3D hotspot system

Zhang,

2022

Preprint

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Transient heat dissipation in close-packed quasi-2D nanoline and 3D nanocuboid hotspot systems is studied based on phonon Boltzmann transport equation. Different from previous intuitive understanding of micro/nano scale heat conduction, it is found that the heat dissipation efficiency is not monotonic when the distance between adjacent nanoscale heat sources decreases. The heat dissipation efficiency reaches the highest value when the distance between adjacent nanoscale heat sources is comparable to the phonon mean free path. It is a competition result of two thermal transport processes: quasiballistic transport when phonons escape from the nanoscale heat source and the scattering among phonons originating from adjacent nanoscale heat source.

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Section: Introductionsupporting

confidence: 84%

Section: Introductionmentioning

confidence: 99%

Non-monotonic heat dissipation phenomenon in close-packed 2D and 3D hotspot system

Zhang,

2022

Preprint

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“…A continuing trend of the miniaturization of electronic devices for information processing [ 1 , 2 , 3 , 4 ], and the increasing power density in high-power electronics [ 5 , 6 , 7 , 8 , 9 , 10 ] dictate the need for more efficient thermal management [ 11 ]. The reliability of devices and systems depend on their operating temperature [ 12 ].…”

Section: Introductionmentioning

confidence: 99%

Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

2021

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We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends on the graphene loading, ξ, non-monotonically, achieving its minimum at the loading fraction of ξ ~15 wt %. Decreasing the surface roughness by Sq~1 μm results in approximately the factor of ×2 decrease in the thermal contact resistance for this graphene loading. The obtained dependences of the thermal conductivity, KTIM, thermal contact resistance, RC, and the total thermal resistance of the thermal interface material layer on ξ and Sq can be utilized for optimization of the loading fraction of graphene for specific materials and roughness of the connecting surfaces. Our results are important for the thermal management of high-power-density electronics implemented with diamond and other wide-band-gap semiconductors.

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“…Moreover, the model has been expanded to consider the interfacial thermal resistance [20], the anisotropy of thermal conductivity [21], the arbitrary number of layers [22] and the temperature-dependent thermal conductivity [23]. However, directly adopting Fourier's law to heat transfer in micro and nanoscale electronic devices will cause some errors [24][25][26]. Mean-free-paths (MFPs) of phonons (the major heat carriers in semiconductors) for…”

Section: Introductionmentioning

confidence: 99%

Thermal spreading resistance of GaN HEMTs with heat source heating studied by hybrid Monte Carlo-diffusion simulations

Li,

Shen,

Hua

et al. 2022

Preprint

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Exact assessment of thermal spreading resistance is of great importance to the thermal management of electronic devices, especially when completely considering the heat conduction process from the nanoscale heat source to the macroscopic scale heat sink. The existing simulation methods are either based on convectional Fourier's law or limited to small system sizes, making it difficult to accurately and efficiently study the cross-scale heat transfer. In this paper, a hybrid phonon Monte Carlo-diffusion method that couples phonon Monte Carlo (MC) method with Fourier's law by dividing the computational domain is adopted to analyze thermal spreading resistance in ballistic-diffusive regime. Compared with phonon MC simulation, the junction temperature of the hybrid method has the same precision, while the time costs could be reduced up to 2 orders of magnitude at most. Furthermore, the simulation results indicate that the heating scheme has a remarkable impact on phonon transport. The thermal resistance of the heat source (HS) scheme can be larger than that of the heat flux (HF) scheme, which is opposite from the prediction of Fourier's law. In the HS scheme, the enhanced phonon-boundary scattering counteracts the broadening of the heat source, leading to a stronger ballistic effect as the heat source thickness decreases. The conclusion is verified by a one-dimensional thermal resistance model. This work has opened up an opportunity for the fast and extensive thermal modeling of crossscale heat transfer in electronic devices and highlighted the influence of heating schemes.

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Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Cited by 45 publications

References 405 publications

Non-monotonic heat dissipation phenomenon in close-packed 2D and 3D hotspot system

Non-monotonic heat dissipation phenomenon in close-packed 2D and 3D hotspot system

Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

Thermal spreading resistance of GaN HEMTs with heat source heating studied by hybrid Monte Carlo-diffusion simulations

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