A standardized method for CMOS unit process development

Abstract

A multipurpose mask set, consisting of three stepper reticles, contains 95% of all test structures required for CMOS process development and random defect detection. Reimizes the feedback loop for defect density data, parametric data and unit process data. crease dramatically, as would the number of test programs associated with these If, however, one standard Overall process, the adverse effects Of unit process opment would be minimized. alizing the mask set by two dozen standard unit processes min-process test mask set characterizes a'' levels Of the

Knowledge Flows and Influence in Online Social Networks: Proposing a Research Agenda

“…Research of the kind described in this section has made contributions to management theory and practice. It has increased the effectiveness of industrial engineering and technology management processes in the semiconductor industry (Cohen,et al [59], Weber, et al [175] [176] [184]- [186]), and it provided economic models that characterized a variety of high tech industries (e.g., Berglund, et al, [22], Biegl, et al [23], Hasenauer, et al [97] [98], Weber, et al [177] [178], Weber & Yang [187]- [191]). It has also contributed to novel theory in the fields of consumer behavior (Albar & Jetter [4], Zenobia, et al, [199]- [202]), knowledge management (Ploykitikoon & Weber [143], Weber [190], Weber,et al [195a], Weber & Yang [189]), R&D management (Ploykitikoon & Weber [144] [145]), open innovation (Mayande,et al [116]- [119], Yang, et al [197], Ploykitikoon & Weber [145]) and organizational change (Yang,et al [197]).…”

Quantifying the value of ownership of yield analysis technologies

“…The high cost test wafers limits the utility of short-cycle experiments. They are primarily conducted in R&D, but yield analysis experts have been known to utilize short-cycle experiments on an ad hoc basis to localize the root cause of yield problems in manufacturing [30].…”

“…At that learning rate, hundreds of millions of dollars could be lost by the time the source of a problem has been identified. Semiconductor manufacturers have thus resorted to fabricating fractions of the process in parallel on test wafers in the manner suggested in the introduction and in reference [30].…”