A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages

Lee, Kheng Chooi; Vythilingam, A.; Alpern, P.

doi:10.1016/j.microrel.2005.07.079

Cited by 11 publications

(7 citation statements)

References 3 publications

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“…The | mechanical properties of underfill are, however, strongly influenced by various environmental factors. Moisture penetrating into the underfill induces expansion and results in reliability failure, such as stress cracking [1,2], delamination and pop-corning during reflow [3]. Such moisture and temperature induced failure has long been recognized as an important issue for package reliability but there is often a lack of reliable material data.…”

Section: Introductionmentioning

confidence: 99%

Characterization and Modeling of Moisture Absorption of Underfill for IC Packaging

Jansen

Ernst

et al. 2007

2007 8th International Conference on Electronic Packaging Technology

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Underfill is a highly particle filled epoxy polymer Teflon foil and ti used in flip chip to fill the gap between the leadframe and die about 300pm. or between die and die. In order to be able to flow in the thin 12.5*4.89*0.385i gap, the silica filler particle must have a diameter below moisture absorpti 10ptm. This epoxy underfill material mechanically couples the as possible. chip and substrate and decreases the stress in the solder joints, therefore enhancing solder fatigue life. Good adhesion 2.2 Equipment of between the epoxy underfill and the surface of solder ball, silicon chip, and substrate is necessary to minimize stress in a A program package. Use of the non-hermetic material does raise a humidity chamb( potential concern, i.e. moisture induced interfacial Fig. 1) delamination and moisture expansion may cause failure. In this study, moisture absorption and desorption properties were investigated, such as moisture absorption equilibrium weight gain and diffusion coefficients at different temperature and different humidity are tested and characterized, moisture absorption and desorption kinetics are tested and fitted

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Section: Introductionmentioning

confidence: 99%

Characterization and Modeling of Moisture Absorption of Underfill for IC Packaging

Jansen

Ernst

et al. 2007

2007 8th International Conference on Electronic Packaging Technology

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“…The mechanical properties of polymers are, however, strongly influenced by various environmental factors. Moisture penetrating into the polymer induces expansion and results in reliability failure, such as stress cracking [1,2], delamination and pop-corning during reflow [3]. Such moisture and temperature induced failure has long been recognized as an important issue for package reliability but there is often a lack of reliable material data.…”

Section: Introductionmentioning

confidence: 99%

Moisture diffusion characterization and comparison of different packaging materials

Liu

Ding

2015

2015 16th International Conference on Electronic Packaging Technology (ICEPT)

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In this paper we determined the water uptake of three kinds electronic packaging materials, including two kinds die attach, two kinds molding compound and two kinds underfill. The three types of polymer which were selected are a die attach filled with silver particles, epoxy molding compound filled with silica particles and underfill also filled with very fine silica particles. The water absorption is carried out in an adjustable thermal and humidity chamber, SGA-100, at different temperatures and humidity levels. Moisture absorption equilibrium of test data were obtained by experiment. The moisture absorption equilibrium prediction equation was modeled by using the extrapolated experimental data. Diffusion coefficients at different temperature were obtained from the moisture absorption experiments.

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“…The mechanical properties of polymers are, however, strongly influenced by various environmental factors. Moisture penetrating into the polymer induces expansion which results in reliability failure, such as cracking [1,2], delamination and pop-coming during reflow [3]. Such moisture and temperature induced failure has long been recognized as an important issue for package reliability but there is often a lack of reliable material data.…”

Section: Introductionmentioning

confidence: 99%

Moisture effects on a system in package carrier

Jansen

Ernst

et al. 2009

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelect

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Moisture induced failures in the plastic encapsulated packages are one most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygromechanical effects are simulated at the following conditions: 85°C/85%RH, 60°C/60%RH and 85°C/dry, 60 °C/dry using 2D SiP(System in Package) finite element model.

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A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages

Cited by 11 publications

References 3 publications

Characterization and Modeling of Moisture Absorption of Underfill for IC Packaging

Characterization and Modeling of Moisture Absorption of Underfill for IC Packaging

Moisture diffusion characterization and comparison of different packaging materials

Moisture effects on a system in package carrier

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