In this paper we determined the water uptake of three kinds electronic packaging materials, including two kinds die attach, two kinds molding compound and two kinds underfill. The three types of polymer which were selected are a die attach filled with silver particles, epoxy molding compound filled with silica particles and underfill also filled with very fine silica particles. The water absorption is carried out in an adjustable thermal and humidity chamber, SGA-100, at different temperatures and humidity levels. Moisture absorption equilibrium of test data were obtained by experiment. The moisture absorption equilibrium prediction equation was modeled by using the extrapolated experimental data. Diffusion coefficients at different temperature were obtained from the moisture absorption experiments.

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