A silicon-on-glass Z-axis accelerometer with vertical sensing comb capacitors

Wang, Jiankun; Yang, Zhiqing; Yan, Guizhen

doi:10.1109/nems.2012.6196843

Cited by 10 publications

(6 citation statements)

References 7 publications

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“…To verify the rationality of the test method proposed in this Letter, this section uses the silicon-on-glass process [13][14][15], which is widely used in the fabrication of the MEMS sensor and actuators to manufacture the test structure, and the impact resistance reliability evaluation test was carried out on the silicon microbeam structure released by the deep reactive ion etching process.…”

Section: Experimentmentioning

confidence: 99%

On‐chip test method for in‐situ evaluating the impact resistance reliability of silicon microbeams

Cheng

Zhang

2020

Micro & Nano Letters

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To the best of the authors' knowledge, this Letter reports and validates for the first time an on-chip reseTable test method that can be used to in-situ evaluate the impact reliability of a process-related silicon microbeam. A test structure integrating impact generating device, test samples, and a lock module is proposed to evaluate the impact-resistant reliability of the process-related microbeam samples with only a common optical microscope and probe station in the fabrication line. A calculation model that uses the LS-Dyna module in the finite-element commercial software ANSYS to process the test results is proposed to obtain the numerical parameters of the impact resistance reliability of the microbeam specimen. The test structure can be manufactured using a variety of mainstream MEMS silicon processes, so it can characterise the impact reliability of silicon microbeam structures under various processes. The above three parts constitute a self-aligned, low-cost test method with automation potential, which can be used for large-scale characterisation of the impact resistance reliability of silicon microbeam structures on the fabrication line. Finally, beam specimens under three different process conditions were manufactured and successfully evaluated using this test method, which verified the rationality of this method.

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Section: Experimentmentioning

confidence: 99%

On‐chip test method for in‐situ evaluating the impact resistance reliability of silicon microbeams

Cheng

Zhang

2020

Micro & Nano Letters

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“…The simple structure, low drift, and low temperature sensitivity of capacitive accelerometers along with demonstrated performance make them suitable design option for seismic applications [46,112].…”

Section: Piezoresistivementioning

confidence: 99%

Accelerometer Sensor Specifications to Predict Hydrocarbon Using Passive Seismic Technique

2016

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The ambient seismic ground noise has been investigated in several surveys worldwide in the last 10 years to verify the correlation between observed seismic energy anomalies at the surface and the presence of hydrocarbon reserves beneath. This is due to the premise that anomalies provide information about the geology and potential presence of hydrocarbon. However a technology gap manifested in nonoptimal detection of seismic signals of interest is observed. This is due to the fact that available sensors are not designed on the basis of passive seismic signal attributes and mainly in terms of amplitude and bandwidth. This is because of that fact that passive seismic acquisition requires greater instrumentation sensitivity, noise immunity, and bandwidth, with active seismic acquisition, where vibratory or impulsive sources were utilized to receive reflections through geophones. Therefore, in the case of passive seismic acquisition, it is necessary to select the best monitoring equipment for its success or failure. Hence, concerning sensors performance, this paper highlights the technological gap and motivates developing dedicated sensors for optimal solution at lower frequencies. Thus, the improved passive seismic recording helps in oil and gas industry to perform better fracture mapping and identify more appropriate stratigraphy at low frequencies.

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“…In [4], for example, a force rebalance readout is proposed by combining lateral comb fingers electrodes (used for sensing) with a parallel plate capacitor located beneath the proof mass (used to electrostatically pull-down the mass in closed-loop operation). In [5]- [6] zaxis accelerometers with asymmetric vertical comb fingers are presented as valid solution to overcome limitations of parallel-plates based readout schemes. In [7], regular comb fingers are instead employed to measure the out-of-plane displacement of the proof mass induced by external acceleration in a non-differential way.…”

Section: Introductionmentioning

confidence: 99%

High Sensitivity Mems Z-Axis Accelerometer with In-Plane Differential Readout

Zega

Gattere

Riani

et al. 2023

2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)

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This paper reports the innovative design and a preliminary experimental characterization of a miniaturized z-axis accelerometer. For the first time in a MEMS accelerometer, a motion conversion mechanism is implemented to allow an electrostatic readout based on in-plane comb fingers, thus overcoming the main limitations of out-of-plane parallel plate detection, e.g. nonlinearities, trade-off between sensitivity and full-scale range, pull-in, etc. The first prototype fabricated by exploiting the features of the Thelma-Double fabrication process shows an experimental sensitivity of 12.9 fF/g which agrees well with numerical predictions computed by considering nominal geometric dimension of the sensor.

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A silicon-on-glass Z-axis accelerometer with vertical sensing comb capacitors

Cited by 10 publications

References 7 publications

On‐chip test method for in‐situ evaluating the impact resistance reliability of silicon microbeams

On‐chip test method for in‐situ evaluating the impact resistance reliability of silicon microbeams

Accelerometer Sensor Specifications to Predict Hydrocarbon Using Passive Seismic Technique

High Sensitivity Mems Z-Axis Accelerometer with In-Plane Differential Readout

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