A silicon integrated circuit force sensor

Fulkerson, D.E.

doi:10.1109/t-ed.1969.16871

Cited by 12 publications

(6 citation statements)

References 2 publications

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“…The piezoresistors were used to detect the maximum stress at the resonant frequency. Fulkerson [192] integrated a bridge and an amplifier circuit in a microfabricated piezoresistive cantilever sensor to linearize and amplify the output, pioneering the concept of signal conditioning integration. Numerous resonant, piezoresistive cantilever devices have been implemented for mass sensing, chemical sensing, and inertial sensing since that time [193]–[195].…”

Section: Devices and Applicationsmentioning

confidence: 99%

Review: Semiconductor Piezoresistance for Microsystems

et al. 2009

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Piezoresistive sensors are among the earliest micromachined silicon devices. The need for smaller, less expensive, higher performance sensors helped drive early micromachining technology, a precursor to microsystems or microelectromechanical systems (MEMS). The effect of stress on doped silicon and germanium has been known since the work of Smith at Bell Laboratories in 1954. Since then, researchers have extensively reported on microscale, piezoresistive strain gauges, pressure sensors, accelerometers, and cantilever force/displacement sensors, including many commercially successful devices. In this paper, we review the history of piezoresistance, its physics and related fabrication techniques. We also discuss electrical noise in piezoresistors, device examples and design considerations, and alternative materials. This paper provides a comprehensive overview of integrated piezoresistor technology with an introduction to the physics of piezoresistivity, process and material selection and design guidance useful to researchers and device engineers.

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Section: Devices and Applicationsmentioning

confidence: 99%

Review: Semiconductor Piezoresistance for Microsystems

et al. 2009

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“…(Fulkerson, 1969) It has been applied to bulk micromachined pressure sensors and accelerometers for medical and automotive sensors.…”

Section: Piezoresistive Sensorsmentioning

confidence: 99%

Technologies, applications, and reliabilities of microelectromechanical systems (MEMS)

Tsuchiya¹

2009

Proceedings of the 9th SEGJ International Symposium

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Microelectromechanical System (MEMS) means batchfabricated miniature devices that integrate sensors and/or actuators to signal conditioning circuits on silicon chips. MEMS is expected as a key component for realizing a new function to various existing systems in consumer, automobile, aeronautics, and instrument applications.Mechanical sensors, such as pressure sensors, accelerometers, and vibrating gyroscopes have been and will be one of the major applications of MEMS. They started with "bulk silicon type" with single crystals silicon structure using piezoresistive sensor and fabrication by anisotropic etching of silicon. They now move into "surface type" with thin films as structures using capacitive sensors and fabrication by sacrificial etching technique. Optical devices are another successful application of MEMS. Not only projection display devices, but also thermal type infrared image sensors and optical switches for fiber optical telecommunication systems have been developed.Such application expansion and product development demand knowledge of the mechanical properties of materials in MEMS. Especially, the mechanical reliabilities are being matters of great concern. Researches on the investigation of the mechanisms and the development of fatigue life prediction methods are being undertaken widely, which will provide us proper knowledge on the fatigue failure and lifetime prediction of MEMS devices.

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“…Piezoresistive effect is the name given to the change in electrical resistivity that occurs with the application of stress (2)(3)(4). Most materials exhibit the piezoresistive effect.…”

Section: Piezoresistance Effectmentioning

confidence: 99%