A SiGe 122-GHz FMCW Radar Sensor with 21.5 dBm EIRP based on a 43-Element Antenna Array in an eWLB Package

Furqan, Muhammad; Ahmed, Faisal; Stelzer, Andreas

doi:10.1109/icmim.2018.8443564

Cited by 15 publications

(6 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Second, it also eliminates the complex assembly technology required to mount the IC on the PCB and connect it to the off-chip antenna substrate [13]. Third, the integration of the entire system in the eWLB package eliminates the need for an RF-compatible substrate for low-loss power transfer from the IC to the antenna, thereby reducing manufacturing complexity and cost, and in particular avoiding the disadvantages of LTCC structures in terms of shrinkage and layer displacement [2], [13], [35], [36]. Therefore, WLB eliminates three cost drivers in system application design.…”

Section: A State Of the Art Wafer Level Packagingmentioning

confidence: 99%

“…Due to small wavelengths at frequencies beyond 220 GHz, whole system-on-chip (SoC) solutions with receiver and transmitter chains, as well as integrated antennas can be developed [3], [6]. This significantly reduces the form factor and cost of the entire system, enabling the integration of compact and low-cost sensors in applications such as autonomous vehicles, drones, or chip-tochip communication in data centers [2], [4], [13].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

Preprint

View full text Add to dashboard Cite

This paper presents a broadband low-loss fanin wafer level ball grid array (WLB) vertical through-moldvia (TMV) interconnect that enables highly integrated systemin-package (SiP) applications beyond 220 GHz. The dedicate advantage of the proposed approach is to further minimize the separation between package components (e.g., antenna in package (AiP)) and on-chip receiver or transmitter chain. To demonstrate the robustness of the TMV interconnect design, the necessity for co-simulation of the integrated circuit (IC) package and the IC itself during the package-design is shown. Therefore, an in-depth analysis of the suppression of parasitic mode oscillation inside silicon is carried out. Furthermore, the parasitic radiation loss at the TMV interconnect discontinuity is given and a verification of the proposed TMV due to high agreement of simulation and measurement results is demonstrated. The interconnect has been verified with a measured 10 dB return loss bandwidth of 38 GHz and a de-embedded insertion loss of less than 2.8 dB at 275 GHz, which enables a compact low-loss broadband signal transition from active IC components in the backend-of-line (BEOL) to passive components in package. Compared to fan-out WLB, the developed fanin WLB solution enables higher integration density of active and passive components with the shortest interconnects for minimal insertion loss. Thus, the proposed fan-in TMV packaging provides a very compact, easy-to-assemble and cost-efficient alternative for SiP designs for future broadband communication and sensing solutions.

show abstract

Section: A State Of the Art Wafer Level Packagingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

Preprint

View full text Add to dashboard Cite

show abstract

“…A small form factor bow-tie antenna with excellent simulated efficiency was presented in [55]. Rhombic antenna arrays of several sizes have been presented in [54] and [56]. These designs demonstrate good gain and bandwidth performance compared to LTCCbased grid arrays in [40], [47], [52].…”

Section: Ewlb Technologymentioning

confidence: 99%

A Review of Design and Integration Technologies for D-Band Antennas

Kok

Smolders

Johannsen

2021

IEEE Open J. Antennas Propag.

View full text Add to dashboard Cite

This article reviews the current state-of-the-art of millimeter-wave (mm-wave) antennas for communication and sensing applications in the D-band between 110 and 170 GHz. The most popular design techniques, including Antenna-on-Board (AoB), slotted waveguides, Antenna-in-Package (AiP) and Antenna-on-Chip (AoC), are described using relevant examples from scientific literature. Potential benefits and limitations of integration technologies, such as specialized packaging, chip post-processing steps and interconnects, are listed as well. The reported performances of all listed designs are compared against each other, taking the antenna size relative to operating frequency into account. This novel comparison indicates that small-scale integrated AiP and AoC designs can achieve competitive performance levels with short and low-loss interconnects.Index Terms-Antenna-in-Package, Antenna-on-Board, Antenna-on-Chip, D-band, millimeter-Wave This document is a result of the NEXTPERCEPTION project (www.nextperception.eu), which is jointly funded by the European Commission and national funding agencies under the ECSEL joint undertaking.

show abstract

“…In the eWLB package, AiPs are generally fabricated on the redistribute layers (RDL) directly with a reflector on PCB. 11,12 However, the fixed stacked layers made of a thick mold compound and very thin RDLs confine the freedom of design, and the tolerance of gap between the antenna on eWLB and PCB reflector, which is determined by the height of the solder ball, may degenerate antenna performance. The second approach is a solution based on microassembly process and wirebond technology.…”

Section: Introductionmentioning

confidence: 99%

“…The first is embedded wafer‐level ball grid array (eWLB) technology, which provides high processing accuracy as well as routing density, and therefore it is potential in the mmW package. In the eWLB package, AiPs are generally fabricated on the redistribute layers (RDL) directly with a reflector on PCB 11,12 . However, the fixed stacked layers made of a thick mold compound and very thin RDLs confine the freedom of design, and the tolerance of gap between the antenna on eWLB and PCB reflector, which is determined by the height of the solder ball, may degenerate antenna performance.…”

Section: Introductionmentioning

confidence: 99%

A D‐band wideband low‐cost array for antenna‐in‐package applications

Chen

Tang

Yue

et al. 2023

Micro & Optical Tech Letters

View full text Add to dashboard Cite

A wideband patch array operating at D‐band for antenna‐in‐package applications is presented in this paper. The array consists of two symmetrically positioned subarray elements and a grounded coplane waveguide feed line. Four E‐shaped patches are loaded in the array to enhance bandwidth. All geometry of the array is manufactured on a single‐layer quartz substrate without via hole, so that the difficulty and cost of fabrication are relieved greatly. Good agreements of reflection coefficient, pattern, and gain between measured and simulated results are achieved. Measurement shows that the array exhibits a −10 dB bandwidth of 19 GHz from 138 to 157 GHz and a 3‐dB gain bandwidth covering 140–159 GHz with a peak gain of 11.8 dBi at 147 GHz. Properties of wideband, moderate gain, low cost, and easy manufacture are achieved in this array.

show abstract

A SiGe 122-GHz FMCW Radar Sensor with 21.5 dBm EIRP based on a 43-Element Antenna Array in an eWLB Package

Cited by 15 publications

References 7 publications

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

A Review of Design and Integration Technologies for D-Band Antennas

A D‐band wideband low‐cost array for antenna‐in‐package applications

Contact Info

Product

Resources

About