Abstract:This paper presents a broadband low-loss fanin wafer level ball grid
array (WLB) vertical through-moldvia (TMV) interconnect that enables
highly integrated systemin-package (SiP) applications beyond 220 GHz.
The dedicate advantage of the proposed approach is to further minimize
the separation between package components (e.g., antenna in package
(AiP)) and on-chip receiver or transmitter chain. To demonstrate the
robustness of the TMV interconnect design, the necessity for
co-simulation of the integrated circui… Show more
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