A Side-Pumping Package Design for Hybrid-Quantum-Dot Light Emitting Diodes

Huang, Chung-Ping; Lee, Ting-Yu; Yang, Jhen-Jia; Shih, H. C.; Hsu, Shun-Chieh; Chen, Teng‐Ming; Lin, Chien-Chung

doi:10.1109/lpt.2021.3065841

Cited by 2 publications

(1 citation statement)

References 16 publications

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“…In this study, the weights of the CQDs in the samples with and without the Sn-ball were kept the same; thus, the volume concentrations of the CQDs differed considerably between the samples with and without the Sn-ball. The high CQD concentration in the sample with the Sn-ball could result in greater reabsorption of emitted red photons, thereby leading to a lower CCE [21]. In the structures of the samples without and with the Sn-ball, the peak wavelengths of red photons were 630.03 and 629.25 nm, respectively.…”

Section: Photonic Characteristics Of Devicesmentioning

confidence: 99%

A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

et al. 2021

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A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging. Under 1 W/cm 2 , the areal temperature decreased from 38.5°C (without Sn-ball) to 32.3°C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package. Specifically, the introduction of the metal ball structure engendered a two-to three-fold increase in lifetime. The study findings could contribute toward integrating quantum dots into photonic devices.

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Section: Photonic Characteristics Of Devicesmentioning

confidence: 99%