A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

Abstract

A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging. Under 1 W/cm 2 , the areal temperature decreased from 38.5°C (without Sn-ball) to 32.3°C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package. Specifically, the introduction of the metal ball structure engendered a two-to three-fold increase in lifetime. The study findings could contribute toward integrating quantum dots into photonic devices.