A self-aligned optical subassembly for multi-mode devices

Dautartas, M.F.; Blonder, G. E.; Wong, Yiu-Huen; Chen, Y.C.

doi:10.1109/96.404115

Cited by 20 publications

(5 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[5][6][7][8] In the UBM system, the Ti layer serves as an adhesion layer, the Pt layer as a diffusion-barrier layer, and the Au layer as a solderable layer. [5][6][7][8] In the UBM system, the Ti layer serves as an adhesion layer, the Pt layer as a diffusion-barrier layer, and the Au layer as a solderable layer.…”

Section: Introductionmentioning

confidence: 99%

Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Park

Lee

et al. 2002

Journal of Elec Materi

View full text Add to dashboard Cite

The reaction characteristics of molten Au/Sn eutectic solder with potential diffusion-barrier materials of optoelectronic packages were investigated. The characteristics were studied by reflowing the solder on Pt, Ni, and Co plates, respectively, and by measuring the thickness of the reaction product. In addition, the dissolution rate of Pt into the solder was measured. The results indicated that Pt, which is commonly used as the diffusion-barrier layer in the under-bump metallurgy (UBM) of optoelectronic packages, reacts readily with the molten solder, resulting in discontinuous reaction products at the solder/Pt interface. Cobalt, on the other hand, reacted with the solder at an order of magnitude slower rate than that of Pt and provided an effective barrier against the reaction with the solder.

show abstract

Section: Introductionmentioning

confidence: 99%

Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Park

Lee

et al. 2002

Journal of Elec Materi

View full text Add to dashboard Cite

show abstract

“…In the standard temperature cycling tests, the switch should be subjected to an ambient temperature change from −5 • C to 75 • C. In the standard insertion loss requirements, an insertion loss of less than 1 dB should be maintained in the multi-mode fiber with a core diameter of 62.5 µm. Dautartas et al [9] and Sutherland et al [10] performed the experiments to build the relations between fiber tips misalignments and the insertion loss, and their results are adopted as our design requirements. Therefore, the axial and transverse misalignments are controlled to within 25 µm and 10 µm, respectively, in this paper.…”

Section: The Design Conceptmentioning

confidence: 99%

A miniature 1×2 mechanical optical switch with anti-thermal design

Chung¹,

Lee²,

Fan³

et al. 2006

J. Micromech. Microeng.

View full text Add to dashboard Cite

This paper studies an innovative miniature 1x2 mechanical optical switch with anti-thermal design. Firstly, a novel switch configuration with the line-to-line and fiber-to-fiber alignments is designed. A fiber stopper pivot design is also proposed to reduce the transverse misalignment of fiber tips due to the positioning errors. Then, an included anti-thermal mechanism is proposed by utilizing materials with different thermal expansion coefficients to compensate the axial misalignment due to ambient temperature changes. Finally, the solid model of the optical switch is generated in AutoCAD, and then imported to ANSYS to analyze different thermal responses. According to the analysis results, the misalignment of the fiber tips is reduced and satisfies the insertion loss requirement of Bellcore specifications. This miniature 1x2 mechanical optical switch has characteristics of small size, low-cost and high reliability.

show abstract

“…Of the various fiber-optic packaging issues, automating the fiberoptic alignment operation is one of the most challenging and is regarded as a critical manufacturing technique [1,2]. In recent decades, the emergence of multi-degree-of-freedom (DOF) automated alignment stages has enabled more flexible alignment processes to be developed.…”

Section: Introductionmentioning

confidence: 99%

A New Simplex Method Based Strategy for Automatic Multiple DOF Laser-Fiber Packaging Alignment

Chang

Tseng

Wang

2006

2006 International Conference on Mechatronics and Automation

View full text Add to dashboard Cite

This paper focused on a fine alignment process for automatic multiple degree-of-freedom (DOF) laser-fiber packaging. Among the alignment algorithms used, the King's modified simplex method (KMSM) has been proven to be very suitable for the fine alignment process because of its fast convergence and ease of implementation. However, direct implementation of this method on a multiple DOF alignment process would lead to local peak trapping problem.In this paper, a KMSM based algorithm is proposed in which the search of the global peak is divided into two stages, namely, 2D alignment and 3D optic axis alignment. The method for the selection of key parameters to prevent the simplex from sticking on the local peaks and to accelerate the search is proposed. The experimental works have proven that the proposed idea is more effective than the conventional KMSM in terms of the rates of success and convergence in all the 100 alignment trials for 10 different LD-fiber pairs, regardless of the initial positions.Index Terms -laser-fiber packaging, alignment, simplex method.

show abstract

A self-aligned optical subassembly for multi-mode devices

Cited by 20 publications

References 6 publications

Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

A miniature 1×2 mechanical optical switch with anti-thermal design

A New Simplex Method Based Strategy for Automatic Multiple DOF Laser-Fiber Packaging Alignment

Contact Info

Product

Resources

About