A Review on Development of Liquid Cooling System for Central Processing Unit (CPU)

Abstract

Electronic devices are becoming more efficient while getting a smaller size and compact design thus increase heat generation significantly. High heat generation from high technology electronic devices are needed to be cool down or control its temperature to prevent overheating problems. Due to the high cooling performance of liquid cooling, the electronic cooling system is shifting from an air-cooling system to a liquid cooling system. In the past few decades, numerous methods proposed by researchers for the central process unit (CPU) cooling using the liquid system either active cooling or passive cooling system. Other than physical configuration such as heat sink design, different configurations of working fluids are widely been studied by most of the researchers. Different working fluids have different heat transfer performance. Furthermore, a recent study has come out more interesting finding using nanofluid which can enhance heat transfer performance of liquid cooling. Nanofluid is a working fluid that has nanoparticles disperse in the base fluid which can increase the thermal properties of the based fluid. In this paper, comprehensive literature on the type of working fluid used in the respective system and methods of liquid cooling system for CPU including its cooling performance. Furthermore, this review paper discussed the different configuration of the liquid block and also the working fluid that had been used in the CPU cooling system.

Comparative study of convection characteristics for a system with deformable interface based on the Navier–Stokes and Oberbeck–Boussinesq equations

“…In the present work, one considers a benzine-air system in a cuvette with the length X = 0.04 m and height Y = 2 × 10 −3 m in the terrestrial conditions at g = 9.81 m s −2 . The thicknesses of the layers Ω 1 and Ω 2 at the initial time t = 0 are assumed to be the same, h 1 = h 2 = 10 −3 m. The dimensions of the heaters embedded in the lower wall are |H l 1 | = 0.0055 m and |H l 2 | = 0.004 m, and the length of the thermal element arranged on the upper boundary is |H up 1 | = 0.005 m. The characteristic temperature drop is taken equal to T * = 10 K. The thermophysical properties of the working media as well as the basic non-dimensional parameters are given below in the order air (1), benzine (2) or specified only for one fluid or for the whole system [17]:…”

“…The dependence ρ = ρ 0 /(1 + βT) is the only one providing the solenoidality property of the velocity field in MM. This state equation is equivalent to those assumed when deriving OBEs with an accuracy up to 2 , where = βT * is the Boussinesq number characterizing the relative temperature non-uniformity of density. Moreover, only such a form of the state equation for an isothermally incompressible liquid ensures that the heat capacity at constant pressure for the fluid does not depend on pressure.…”

“…Problems associated with the study of convective fluid flows continue to attract the keen interest of the scientific community. The concern is motivated by modern applications of omnigenous fluidic systems in different fields from microelectronics and thermophysics [1,2] to material science and biomedicine [3–5]. In many cases, the practical development of technologies is accompanied by extensive theoretical investigations, which, in some cases, can lead to a revision of standard mathematical models and approaches to the study of a certain class of problems.…”

Modelling 2-D Heat Transfer Problem for Different Material Combination

“…In general, it should produce the same results or results very similar to those of previous studies. Furthermore, it is crucial to gain a thorough understanding of a numerical code's capabilities and limitations in order to achieve high accuracy [10]. A fair comparison of results was ensured by using identical geometry, grid size, and boundary conditions to those used in the ANSYS simulation.…”

Effects of Heat Transfer on Flow of MHD Maxwell Nanofluid on Stretching and Shrinking Surfaces.

“…Nanofluids are used in several kinds of heat transfer applications, namely soil remediation procedures, oil recovery, home refrigerator chillers, electronic cooling,heated pipes,lubrication, microelectronic fuel cells, detergency, and solar-powered water chillers. Nanofluids are referred to study regarding enhancing heat transmission when refrigerating central processing unit (CPU) system [9]. Nanofluids are utilized for fluid cooling of computer processors because of their enhanced thermal conductivities.…”