2023
DOI: 10.37934/arfmts.111.1.135155
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Modelling 2-D Heat Transfer Problem for Different Material Combination

Su Hian Ho,
Yit Yan Koh,
Chong Lye Lim
et al.

Abstract: The analysis of heat transfer problems can be highly complex due to factors such as temperature, position, and time. Most heat transfers are typically two-dimensional as conduction is often negligible in the third dimension. Two-dimensional heat conduction problems can be solved analytically or numerically. In steady-state conditions, the Laplace equation can be applied to solve two-dimensional heat conduction problems analytically, in which the separation of variables method is used to solve the Laplace equat… Show more

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