2016
DOI: 10.1016/j.applthermaleng.2016.05.096
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A review of the capabilities of high heat flux removal by porous materials, microchannels and spray cooling techniques

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Cited by 172 publications
(39 citation statements)
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“…Finally, due to the two reasons previously described, the limits where cooling with finned or pinned heat sinks in conjunction with a source of air flow is adequate are being reached. Thus, it is necessary to use direct cooling systems such as the liquid cooling, both forced convection and immersion [7], jet impingement [8], spray cooling [9] and indirect systems such as the use of heat pumps, thermoelectric modules [10], heat pipes [11] and phase change materials, which transport heat to be dissipated in a simpler way far from the hot spot.…”
Section: Electronics Thermal Managementmentioning
confidence: 99%
“…Finally, due to the two reasons previously described, the limits where cooling with finned or pinned heat sinks in conjunction with a source of air flow is adequate are being reached. Thus, it is necessary to use direct cooling systems such as the liquid cooling, both forced convection and immersion [7], jet impingement [8], spray cooling [9] and indirect systems such as the use of heat pumps, thermoelectric modules [10], heat pipes [11] and phase change materials, which transport heat to be dissipated in a simpler way far from the hot spot.…”
Section: Electronics Thermal Managementmentioning
confidence: 99%
“…Machining of micro/mini channel profiles on various work materials has gained research interest among several groups because of higher heat dissipation capability by allowing the cooling fluids to flow through them. 1,2 Various conventional and non-conventional machining methods were reported and are being practiced to make these channels. Haghbin et al 3 used abrasive water-jet micro-milling to machine the channels on 316L stainless steel and aluminum alloy AA6061T6.…”
Section: Introductionmentioning
confidence: 99%
“…For compact integrated circuits (ICs) & laser mirror the highest value of q o recorded is 10 2 W/cm 2 [1], for aeronautics and VLSI 10 3 W/cm 2 required to be dissipated [1] and for fusion reactor and defense applications 10 4 W/cm 2 heat flux removal is recorded [2]. A MCHS is an right choice to dissolve heat fluxes up to 10 3 W / cm 2 [1] as it provides a heat rejection area to volume ratio of approximately 15,294 m 2 / m 3 compared to 650 m 2 / m 3 for a closely packed heat exchanger [3]. Micro-channels act as flow paths for the working fluid in dimensions ranging from 10 to 1000 micrometres [4].…”
Section: Introductionmentioning
confidence: 99%