Impact of Channel Geometries and Flow Patterns On Micro-Channel Heat Sink Performance

Abstract

Demand for greater capability of electronic devices in very small volume for compactness has affected huge augmentations in heat indulgence at all stages of device, electronic wrapping, test section and system. Latest cooling systems are hence needed to eliminate the released heat while maintaining compactness of the device. The micro-channel heat sink (MCHS) is ideal for this situation as it consists of channels of micron size which offers an extended surface area to volume ratio of approximately 15.294 m2 / m3 compared to 650 m2 / m3 for a typical heat compact exchanger. A comprehensive review has been done for consequence of heat flux (qo ), mass flux (G), vapour quality (x) and channel geometries at flow patterns and heat dissipation of MCHS. The study show that to increase the rate of heat transfer by using different channel geometries like converging-diverging, segmented etc. compared to conventional rectangular micro-channels has given better cooling effect The Flow patterns like bubbly, slug flow are associated with nucleate boiling dominated in low vapour quality and annular flow also given the significant effect on heat transfer in higher vapour quality region

Application of Semi-Circular Micro-Channel Heat Sink with Phase Change Material for Cooling of Electronic Devices

“…Usually Micro-channel heat sink is constructed from higher thermal conductivity materials such as copper, aluminum, brass etc. consisting channels of micron size (10 to 1000 μm) which acted as a passage of cooling fluid [5]. Only standard cooling technology would not be enough when electronic devices are continuously operated over longer periods due to space limitations and some limitations of thermal conductivity of cooling fluid and materials of heat sink the heat load generated cannot be properly dissipated.…”