2020
DOI: 10.1109/jestpe.2019.2953102
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A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages

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Cited by 58 publications
(25 citation statements)
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“…For higher power dissipation devices (e.g. high-performance computing and power electronics) liquid cooling is already being adopted [95,96]. Passive two-phase cooling systems such as heat pipes have gained much attention for cooling computer processors, but are inadequate for future cooling requirements [96].…”
Section: Statusmentioning
confidence: 99%
See 1 more Smart Citation
“…For higher power dissipation devices (e.g. high-performance computing and power electronics) liquid cooling is already being adopted [95,96]. Passive two-phase cooling systems such as heat pipes have gained much attention for cooling computer processors, but are inadequate for future cooling requirements [96].…”
Section: Statusmentioning
confidence: 99%
“…high-performance computing and power electronics) liquid cooling is already being adopted [95,96]. Passive two-phase cooling systems such as heat pipes have gained much attention for cooling computer processors, but are inadequate for future cooling requirements [96]. Active two-phase cooling systems remains an active research area for high power density applications, however, market penetration is still pending.…”
Section: Statusmentioning
confidence: 99%
“…WBG device applications are explored in electrical drive systems. When the motor controller's power density exceeds 25 kW/L, the WBG semiconductor can be used for heating reduction due to low conduction loss at a high-frequency switching operation [37]. A buck converter prototype with a SiC power module was established for continuous operation at high-temperature operation [38].…”
Section: Power Electronic Devices In Controlmentioning
confidence: 99%
“…The evolving configuration, from box-to-box to coaxial, could be achieved in smaller volume but with increased power density and output. It is expected that more prototypes of fully integrated units will emerge in the next few years so that power electronic system could be completely embedded into the motor casing and sharing cooling loops become a realistic thermal management approach [103,104].…”
Section: Trends In Integrating Power Electronics Into Electrified Powmentioning
confidence: 99%