2022
DOI: 10.1038/s41928-022-00729-7
|View full text |Cite
|
Sign up to set email alerts
|

A resonant metamaterial clock distribution network for superconducting logic

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
9
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 12 publications
(9 citation statements)
references
References 21 publications
0
9
0
Order By: Relevance
“…Measurements were taken at 4.2K in a LHe Dewar using an RF dip probe equipped with a 32-contact-pad test fixture. 11,18,19,21 To provide for fast sample exchange, a flip-chip press-contact technology is used, where the chip contact pads are pressed against the fixture non-magnetic Cu/Au bumps. The fixture PCB interfaces the bumps to the probe semi-rigid coaxial cables.…”
Section: Methodsmentioning
confidence: 99%
See 2 more Smart Citations
“…Measurements were taken at 4.2K in a LHe Dewar using an RF dip probe equipped with a 32-contact-pad test fixture. 11,18,19,21 To provide for fast sample exchange, a flip-chip press-contact technology is used, where the chip contact pads are pressed against the fixture non-magnetic Cu/Au bumps. The fixture PCB interfaces the bumps to the probe semi-rigid coaxial cables.…”
Section: Methodsmentioning
confidence: 99%
“…4 However, a metamaterial zeroth order resonator (ZOR) delivering clock and power to RQL gates at GHz frequencies dissipated twice more power than the logic junctions, due to the loss in transmission lines forming the ZOR. 11 Interconnect density remains one of the main factors limiting the scalability of all forms of superconducting logic. 12 The performance capability of an SFQ logic chip increases with the total number of logic gates, which calls for more interconnect layers with smaller wire width and spacing (pitch).…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…[13][14][15][16][17] The fine-pitch interconnect technology has become one of the important research areas for the microelectronics industry to meet the increasing demands of downsizing, functionalization, and integration. [18][19][20][21] Anisotropic materials can achieve different functions in different directions. [22][23][24] As one type of interconnection materials for electronic components, anisotropic conductive films (ACFs) possess a specific directional conductivity.…”
Section: Introductionmentioning
confidence: 99%
“…Despite some inspiring clocking approaches discussed for RQL [22,23], a global clocking scheme to maintain low clock skew for AQFP circuits at large scale still requires attention. In this work, we investigate a global clocking scheme for low clock skew AQFP circuits by employing grid-distributed blocks synchronized by H-tree power-clock networks.…”
Section: Introductionmentioning
confidence: 99%