A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications

Sauveplane, Jean-Baptiste; Retho, Patrice; Venet, N.; Buso, David; Perez, Guy; Lefrileux, Jean-Sébastien

doi:10.1016/j.microrel.2015.06.060

Cited by 7 publications

(2 citation statements)

References 2 publications

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“…The KlettWelding interconnections are from pure copper and free of any rare or toxic metals and no multi-layer structure as well. Also, in this technique the mismatch of the thermal expansions between the BGA and substrates by rapid temperature changes [1] vanishes.…”

Section: Introductionmentioning

confidence: 99%

Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

Roustaie

Quednau

Dassinger

et al. 2020

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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Section: Introductionmentioning

confidence: 99%

Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

Roustaie

Quednau

Dassinger

et al. 2020

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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“…Confirming the condition of the solders or reconnecting the components is difficult in the connecting process because almost all terminals are covered by the component body 2 . In addition, the mismatch of the thermal expansion coefficient between the LGA and the substrate, in the case of the LGA, is a problem for future micro-/nano-electronic devices 3,4 . Meanwhile, almost all the surface-mount techniques in the connecting part of the electronic components depend on soldering.…”

Section: Introductionmentioning

confidence: 99%

A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding

Toku

Ichioka

Morita

et al. 2019

Sci Rep

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Surface-mount techniques primarily depend on soldering. However, soldering techniques have encountered some challenges in recent years. These challenges include rare metal recycling, thermal problems, and Pb toxicity. We recently developed a metallic nanowire surface fastener (NSF) to resolve the abovementioned problems. This fastener can be used to connect electronic components on a substrate at room temperature using the van der Waals force between each nanowire. This study demonstrates a 64-pin NSF that behaves like a ball grid array (BGA) for application to actual electronic devices. The adhesion strength and electrical properties of the NSF were investigated by adjusting the nanowire parameters, such as diameter, length, density (number per area), preload, and shape. The shape control of the nanowires greatly contributed to the improvement of the properties. A maximum adhesion strength of 16.4 N/cm2 was achieved using a bent, hook-like NSF. This strength was 4–5 times the value of the straight NSF. The contact resistivity was 2.98 × 10−2 Ω∙cm2. The NSF fabricated through the simple template method showed the room temperature bonding ability and adaptability to a highly ordered electrode like the BGA.

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Numerical simulation of SAC305/Cu friction inlay welding based on Coupled Eulerian–Lagrangian approach

Zhao,

Zhang,

Wei

et al. 2024

Int J Adv Manuf Technol

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A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications

Cited by 7 publications

References 2 publications

Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding

Numerical simulation of SAC305/Cu friction inlay welding based on Coupled Eulerian–Lagrangian approach

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