A reduced percolation threshold of hybrid fillers of ball-milled exfoliated graphite nanoplatelets and AgNWs for enhanced thermal interface materials in high power electronics

Chang, Tien Chan; Kwan, Yee Kwan; Fuh, Yiin Kuen

doi:10.1016/j.compositesb.2020.107954

Cited by 17 publications

(6 citation statements)

References 57 publications

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“…Chang et al assembled high-quality ball milling exfoliated graphite nanosheets (BMEGN) and silver nanowires (AgNWs) on a flexible polydimethylsiloxane (PDMS) substrate. When the loading of AgNWs thermal film is 2.0 mg/mL, the in-plane thermal conductivity of the composite material is significantly increased to 29.2 W/(m·K) [ 25 ]. Unique connected structure fillers were also reported, which were fabricated by many methods, such as grafting and so on [ 18 , 26 ].…”

Section: Introductionmentioning

confidence: 99%

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Huang

Drummer

et al. 2021

Polymers

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In this work, polydimethylsiloxane (PDMS)-based composites with high thermal conductivity were fabricated via a three-dimensional hybrid boron nitride@silver nanowires (BN@AgNWs) filler thermal network, and their thermal conductivity was investigated. A new thermal conductive BN@AgNWs hybrid filler was prepared by an in situ growth method. Silver ions with the different concentrations were reduced, and AgNWs crystallized and grew on the surface of BN sheets. PDMS-based composites were fabricated by the BN@AgNWs hybrid filler added. SEM, XPS, and XRD were used to characterize the structure and morphology of BN@AgNWs hybrid fillers. The thermal conductivity performances of PDMS-based composites with different silver concentrates were investigated. The results showed that the thermal conductivity of PDMS-based composite filled with 20 vol% BN@15AgNWs hybrid filler is 0.914 W/(m·K), which is 5.05 times that of pure PDMS and 23% higher than the thermal conductivity of 20 vol% PDMS-based composite with BN filled. The enhanced thermal conductivity mechanism was provided based on the hybrid filler structure. This work offers a new way to design and fabricate the high thermal conductive hybrid filler for thermal management materials.

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Section: Introductionmentioning

confidence: 99%

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Huang

Drummer

et al. 2021

Polymers

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“…Thermal interface materials (TIMs) with high performance are urgently needed with the development of integration and miniaturization of microelectronics and portable devices. [1][2][3][4] Polymers have great potentials for being used as TIMs due to their superior chemical resistance, low cost, light weight, and good processability. 5,6 Unfortunately, polymers possess low-thermal conductivity (TC), which cannot satisfy the great demand in heat dissipation of microelectronics.…”

Section: Introductionmentioning

confidence: 99%

Matching micro‐ and nano‐boron nitride hybrid fillers for high‐thermal conductive composites

Liu

Yang

Dong

et al. 2021

J of Applied Polymer Sci

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Incorporating hybrid fillers into polymer has been considered as one of the effective ways to obtain composites with high-thermal conductivities (TCs). Herein, we fabricated polytetrafluoroethylene (PTFE) composites by using micro-boron nitride nanosheets (mBNNs) and nano-BNNs (nBNNs) as fillers, and studied the optimum ratios of mBNNs to nBNNs (i.e., mBNNs:nBNNs) for obtaining high-thermal conductive composites at different filler's contents. The results indicated that for the composites with total BNNs contents of 10, 20, and 30 wt%, the optimum mBNNs:nBNNs for obtaining the highest TC were 9:1, 9:1, and 5:5, respectively. The highest TC of the composites with 30 wt% BNNs could reach 1.46 WÁm −1 ÁK −1 , which was 356% higher than that of PTFE. The reasons for optimum mBNNs:nBNNs values were interpreted by observing the composite's microstructures. Moreover, the fabricated composites also exhibited excellent electrical insulation properties. This study has important implications for obtaining high-thermal conductive composites using hybrid fillers.

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“…[ 4–8 ] Currently, the state‐of‐the‐art TIMs are made up of elastomer composites with the silicone matrix (generally, polydimethylsiloxane (PDMS)) and highly thermally conductive fillers, such as Al 2 O 3 , [ 9 ] BN, [ 10 ] carbon fibers, [ 11,12 ] and nanomaterials (graphene, carbon nanotubes, metal nanowires, etc.). [ 13–16 ] Among the above filler materials, graphene has attracted a great deal of attention because of its excellent intrinsic thermal conductivity (along the basal plane ≈5000 W m −1 K −1 ). [ 17 ] However, different from the spherical fillers having isotropic physical properties, the nature of 2D layered materials gives graphene a highly anisotropic thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

Soft and Self‐Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling

Alam²,

Gao

et al. 2021

Adv Funct Materials

121

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Urged by the increasing power and packing densities of integrated circuits and electronic devices, efficient dissipation of excess heat from hot spot to heat sink through thermal interface materials (TIMs) is a growing demand to maintain system reliability and performance. In recent years, graphene‐based TIMs received considerable interest due to the ultrahigh intrinsic thermal conductivity of graphene. However, the cooling efficiency of such TIMs is still limited by some technical difficulties, such as production‐induced defects of graphene, poor alignment of graphene in the matrix, and strong phonon scattering at graphene/graphene or graphene/matrix interfaces. In this study, a 120 µm‐thick freestanding film composed of vertically aligned, covalently bonded graphene nanowalls (GNWs) is grown by mesoplasma chemical vapor deposition. After filling GNWs with silicone, the fabricated adhesive TIMs exhibit a high through‐plane thermal conductivity of 20.4 W m−1 K−1 at a low graphene loading of 5.6 wt%. In the TIM performance test, the cooling efficiency of GNW‐based TIMs is ≈1.5 times higher than that of state‐of‐the‐art commercial TIMs. The TIMs achieve the desired balance between high through‐plane thermal conductivity and small bond line thickness, providing superior cooling performance for suppressing the degradation of luminous properties of high‐power light‐emitting diode chips.

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A reduced percolation threshold of hybrid fillers of ball-milled exfoliated graphite nanoplatelets and AgNWs for enhanced thermal interface materials in high power electronics

Cited by 17 publications

References 57 publications

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Matching micro‐ and nano‐boron nitride hybrid fillers for high‐thermal conductive composites

Soft and Self‐Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling

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