A Rapid Technique of Evaluating Thermally Induced Strains in Leadless Ceramic Chip Carriers Mounted to Polymeric Substrates

Abstract

A method has been developed which quantitatively evaluates the integrity of leadless ceramic chip carrier (LCCC) mounting schemes. This method utilizes strain gages and compares mounted and unmounted LCCC's during temperature tests. This technique enables the designer to evaluate critical material parameters with a single temperature excursion.