Abstract:Ultra-thin high-k dielectric films have attracted world-wide interest for DRAM capacitor or gate dielectric applications. Defect states in high-k dielectric are responsible for leakage current or mobility degradation due to remote Coulomb scattering. Hence there is a need to develop a technology to detect those defect states. We have successfully developed a novel zero-bias thermally stimulated current (ZBTSC) spectroscopy technique which is applicable to capacitors with sub-10 nm high-k dielectric. Tantalum o… Show more
“…Ta 2 O 5 was deposited onto (100) n + -Si or p + -Si wafers by lowpressure metal-organic chemical vapor deposition (LP-MOCVD), as discussed before. [17][18][19][20][21][22] The precursor used was tantalum ethoxide with the chemical formula of Ta(OC 2 H 5 ) 5 . As deposited Ta 2 O 5 film is amorphous and very leaky.…”
Section: Methodsmentioning
confidence: 99%
“…ZBTSC (zero-bias thermally stimulated current) measurements were performed at a ramp rate of 0.5 K/s as before. [17][18][19][20][21][22] Conventional TSC technique suffers from a serious parasitic current problem because of the need to apply a bias voltage to the sample. The purpose of "zero bias" is to solve this parasitic current problem.…”
Section: Methodsmentioning
confidence: 99%
“…This problem can be partially solved by using a novel zero-bias thermally stimulated current (ZBTSC) spectroscopy technique. [17][18][19] The purpose of zero bias is to get rid of a parasitic leakage current that can interfere with the measurement. Experience shows that even ZBTSC may not be sufficient such that a more sophisticated technique like zero-temperature gradient ZBTSC has to be used, 20,21 as shown in Fig.…”
Historically, it has been difficult to correlate the leakage current of capacitor structures involving high-k dielectric materials and defect states detected spectroscopically by the thermally stimulated current (TSC) technique. Four mechanisms are proposed and solutions are explained with tantalum oxide as an example. One of the mechanisms is the limitation of the TSC technique itself because of the presence of a parasitic current due to the bias voltage used. This can be solved by migrating to more advanced versions of TSC like zero-bias TSC or zero-temperature-gradient zero-bias TSC. In addition, another possible mechanism is that some defect states may have an electron repulsive energy barrier. Furthermore, another possible mechanism is that the leakage current may be insensitive to the presence of defect states under some situations; a unified Schottky-Poole-Frenkel model is proposed by the author to explain such a situation. Finally, another mechanism is due to the non-uniform distribution of defect states. Sometimes, this can be solved by using a 2-zone model proposed by the author.
“…Ta 2 O 5 was deposited onto (100) n + -Si or p + -Si wafers by lowpressure metal-organic chemical vapor deposition (LP-MOCVD), as discussed before. [17][18][19][20][21][22] The precursor used was tantalum ethoxide with the chemical formula of Ta(OC 2 H 5 ) 5 . As deposited Ta 2 O 5 film is amorphous and very leaky.…”
Section: Methodsmentioning
confidence: 99%
“…ZBTSC (zero-bias thermally stimulated current) measurements were performed at a ramp rate of 0.5 K/s as before. [17][18][19][20][21][22] Conventional TSC technique suffers from a serious parasitic current problem because of the need to apply a bias voltage to the sample. The purpose of "zero bias" is to solve this parasitic current problem.…”
Section: Methodsmentioning
confidence: 99%
“…This problem can be partially solved by using a novel zero-bias thermally stimulated current (ZBTSC) spectroscopy technique. [17][18][19] The purpose of zero bias is to get rid of a parasitic leakage current that can interfere with the measurement. Experience shows that even ZBTSC may not be sufficient such that a more sophisticated technique like zero-temperature gradient ZBTSC has to be used, 20,21 as shown in Fig.…”
Historically, it has been difficult to correlate the leakage current of capacitor structures involving high-k dielectric materials and defect states detected spectroscopically by the thermally stimulated current (TSC) technique. Four mechanisms are proposed and solutions are explained with tantalum oxide as an example. One of the mechanisms is the limitation of the TSC technique itself because of the presence of a parasitic current due to the bias voltage used. This can be solved by migrating to more advanced versions of TSC like zero-bias TSC or zero-temperature-gradient zero-bias TSC. In addition, another possible mechanism is that some defect states may have an electron repulsive energy barrier. Furthermore, another possible mechanism is that the leakage current may be insensitive to the presence of defect states under some situations; a unified Schottky-Poole-Frenkel model is proposed by the author to explain such a situation. Finally, another mechanism is due to the non-uniform distribution of defect states. Sometimes, this can be solved by using a 2-zone model proposed by the author.
“…This situation is particularly serious if the high-k dielectric is in the form of an ultrathin film. This problem can be partially solved by using a novel zero-bias thermally stimulated current (ZBTSC) spectroscopy technique [17]- [19]. The purpose of zero bias is to get rid of a parasitic leakage current that can interfere with the measurement.…”
Historically, it has been difficult to correlate the leakage current of capacitor structures involving high-k dielectric materials and defect states detected spectroscopically by the thermally stimulated current (TSC) technique. Four mechanisms are proposed and solutions are explained with tantalum oxide as an example. One of the mechanisms is the limitation of the TSC technique itself because of the presence of a parasitic current due to the bias voltage used. This can be solved by migrating to more advanced versions of TSC like zero-bias TSC.
In this letter, the authors will point out that defect states related to impurities or structural defects in tantalum oxide capacitors can be passivated by hydrogen during postmetallization anneal (PMA) while oxygen vacancies are enhanced by PMA such that some will observe a decrease while other may observe an increase in the leakage current after PMA. The PMA process can be tuned such that the hydrogen passivation of defect states dominates over the enhancement of oxygen vacancies, resulting in significant leakage current reduction.
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