A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials

Arif, Muhammad; Zhang, Xinquan; Rahman, M.; Kumar, Annamalai Senthil

doi:10.1016/j.ijmachtools.2012.08.005

Cited by 166 publications

(39 citation statements)

References 21 publications

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“…From the mechanical perspective, the cutting mode depends on whether the resolved shearing or tensile stress exceeds its critical value in certain directions [186]. Moreover, the ductile-brittle transition (DBT) phenomenon can be treated as the intersection point of the specific cutting energy curves representing the ductile and brittle behavior, respectively [9]. When considering DBT at the atomic level, a peak deformation zone under tensile stress state would be formed near the tool edge, which could be treated as the initialization of microcracks [19].…”

Section: Mechanisms Of Nanomanufacturingmentioning

confidence: 99%

Nanomanufacturing—Perspective and applications

et al. 2017

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Section: Mechanisms Of Nanomanufacturingmentioning

confidence: 99%

Nanomanufacturing—Perspective and applications

et al. 2017

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“…Some research on ductile mode cutting of crystalline silicon have been reported [5,21,22]. The critical depth of cut, at which the cutting mechanism transforms from purely ductile to brittle mode, depends on material property, tool shape, and cutting conditions.…”

Section: Model Of Materials Removal In Abrasive Machining Of Hard and mentioning

confidence: 99%

Depth of cut per abrasive in fixed diamond wire sawing

Chung

2015

Int J Adv Manuf Technol

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Because of the high requirement for quality, the surfaces of prime wafers have to be flat and without damages. During the first machining process in wafer manufacturing, the defects introduced by wire sawing must be removed by the subsequent lapping, grinding, and polishing processes. Therefore, the quality of sliced wafer is very important. Fixed diamond wire saw, on which the diamond grains are coated as abrasives, has become the major tool to slice ingot into wafers. Ductile-regime machining is an attractive process to achieve crack free surface on brittle materials in abrasive machining process. The depth of cut of the abrasive is a hint for the transition between ductileand brittle-regime machining. In order to understand the cutting behavior in fixed diamond wire sawing, this paper presents an investigation of depth of cut per abrasive based on the wire profile model developed by the authors. The simulation results show that the larger depths of cut are unavoidable in fixed diamond wire sawing because of the random position and size distribution of diamond grains on the wire. Although the number of active abrasives and the depths of cut at the bottom of slicing groove are larger than those at the side of the groove, few larger diamond Van-Nhat Le grains may introduce larger depths of cut and cracks on the side, which is the sliced wafer surface. Effects of process parameters to the depth of cut distributions are also analyzed. The variation in number of active abrasives in cutting zone as well as their depth of cut shows the possibility to increase process productivity without increasing the depths of cut of the diamond grains. Consequently, the surface quality could be remained without further deterioration.

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“…3. The median cracks produce subsurface damage, while the lateral cracks determine the removal of material in the form of hemi-spherical packets from the bulk material [26]. The size of the removed hemi-spherical packet is determined both by the thrust force F t and the cutting force F c .…”

Section: Introductionmentioning

confidence: 99%

“…The crack systems in single-edge non-overlapping cut with cutting velocity normal to the shown plane of cross section[26] Trajectories of the fly cutting when the KDP crystal is fed. a Along Y direction.…”

mentioning

confidence: 99%

A hybrid method for crackless and high-efficiency ultraprecision chamfering of KDP crystal

Chen¹,

Chen²,

Wang³

2016

Int J Adv Manuf Technol

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To enhance the optical performance of the optics used in inertial confinement fusion (ICF), the edges of the large-sized KDP crystal need to be removed to form chamfered faces with high surface quality (RMS <5 nm). Fly cutting with single point diamond tool has been widely used to process potassium dihydrogen phosphate (KDP) to achieve extremely high surface quality. However, the depth of cut (DOC) of fly cutting is usually several microns, which results in very low machining efficiency for the chamfering of KDP crystal as the amount of materials to be removed is in the order of millimeter. To overcome this problem, this paper proposes a hybrid machining method by combining precision grinding with fly cutting to achieve crackless and high-efficiency ultraprecision chamfering of KDP crystal. In addition, a combined machine tool has been developed, and experiments have been carried out to determine the optimal machining procedures and verify the effectiveness of the proposed method. Experimental results show that the machining efficiency can be improved by nearly five times using the proposed method to produce the same machined surface quality as that of the traditional fly cutting process.

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A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials

Cited by 166 publications

References 21 publications

Nanomanufacturing—Perspective and applications

Nanomanufacturing—Perspective and applications

Depth of cut per abrasive in fixed diamond wire sawing

A hybrid method for crackless and high-efficiency ultraprecision chamfering of KDP crystal

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